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Semiconductor acceleration sensor device and fabrication method thereof

一种加速度传感器、半导体的技术，应用在半导体器件、测量加速度、速度/加速度/冲击测量等方向，能够解决不能高精度检测加速度等问题，达到抑制畸变、检测精度提高的效果

Inactive Publication Date: 2006-12-06
OKI ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, there is a problem that the acceleration cannot be detected with high precision when the temperature changes

Method used

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  • Semiconductor acceleration sensor device and fabrication method thereof
  • Semiconductor acceleration sensor device and fabrication method thereof
  • Semiconductor acceleration sensor device and fabrication method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0053] Use below Figure 1 to Figure 4 The structure and manufacturing method of the semiconductor acceleration sensor device according to Embodiment 1 of the present invention will be described. figure 1 (b) is a plan view of the semiconductor acceleration sensor device of this embodiment. figure 1 (a) is a cross-sectional view of the semiconductor acceleration sensor device of the present embodiment, and is figure 1 Sectional view of part A-A' of (b). figure 2 (a) is a plan view of the semiconductor acceleration sensor device according to this embodiment in a state where the upper cover 10 , the adhesive 8 , the wires 14 , and the acceleration sensor chip 4 are removed. figure 2 (b) for the figure 2 (a) is a plan view of a state where the acceleration sensor chip 4 is placed on the low elastic member 3 . image 3 is the shape, size or position of the low elastic member 3 and figure 2 (a) An example of a case where the low elastic member 3 shown in (a) is differen...

Embodiment approach 2

[0111] Use below Figure 7 to Figure 9 and Figure 4 The structure and manufacturing method of the semiconductor acceleration sensor device according to Embodiment 2 of the present invention will be described. In addition, the description of the same parts as the configuration and manufacturing method of the semiconductor acceleration sensor device according to Embodiment 1 will be omitted.

[0112] [structure]

[0113] Figure 7 (b) is a plan view of the semiconductor acceleration sensor device of this embodiment. Figure 7 (a) is a cross-sectional view of the semiconductor acceleration sensor device of the present embodiment, and is Figure 7 Sectional view of part A-A' of (b). Figure 8 (a) is a plan view of the semiconductor acceleration sensor device according to this embodiment in a state where the upper cover 10 , the adhesive 8 , the wires 14 , and the acceleration sensor chip 4 are removed. Figure 8 (b) is in Figure 8 (a) is a plan view of a state where the acc...

Embodiment approach 3

[0129] Use below Figure 10 to Figure 12 and Figure 4 The structure and manufacturing method of the semiconductor acceleration sensor device according to Embodiment 3 of the present invention will be described. In addition, the description of the same parts as the configuration and manufacturing method of the semiconductor acceleration sensor device according to Embodiment 1 will be omitted.

[0130] [structure]

[0131] Figure 10 (b) is a plan view of the semiconductor acceleration sensor device of this embodiment. Figure 10 (a) is a cross-sectional view of the semiconductor acceleration sensor device of the present embodiment, and is Figure 10 Sectional view of part A-A' of (b). Figure 11 (a) is a plan view of the semiconductor acceleration sensor device according to this embodiment in a state where the upper cover 10 , the adhesive 8 , the wires 14 , and the acceleration sensor chip 4 are removed. Figure 11 (b) is in Figure 11 (a) is a plan view of a state whe...

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Abstract

A semiconductor acceleration sensor device has an acceleration sensor chip and a hollow package to house the acceleration sensor chip. A concave section is formed in a predetermined area on a bottom face inside the package. The semiconductor acceleration sensor device also has a low elasticity element with adhesiveness. The low elasticity element is filled in the concave section. The acceleration sensor chip is mounted on the low elasticity element. The adhesive surface between the low elasticity element and the acceleration sensor chip is higher than the bottom face.

Description

technical field [0001] The present invention relates to a semiconductor acceleration sensor device in which an acceleration sensor chip is mounted in a package. Background technique [0002] Conventionally, there has been a semiconductor acceleration sensor device in which an acceleration sensor chip that outputs an electrical signal corresponding to the magnitude and direction of applied acceleration is mounted in a package. [0003] Various types of semiconductor acceleration sensor devices have been known so far. As its representative example, there are Figure 17 The semiconductor acceleration sensor device with the structure shown. This semiconductor acceleration sensor device is the Figure 16 The acceleration sensor chip 4 is installed in the package 1 of the device. [0004] The structure of the acceleration sensor chip 4 is that the weight 16 at the center is supported by four beams 18 , and the piezoelectric resistance element 20 is provided on the beams 18 . B...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01P15/00
CPCG01P15/0802G01P1/023H01L2224/32225H01L2224/83385H01L2224/73265H01L2924/15153H01L2924/16195G01P15/08
Inventor 猪野好彦
Owner OKI ELECTRIC IND CO LTD
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