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Heat radiator of heat pipe

A heat dissipation device and heat pipe technology, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve the problems of large flow resistance, long return distance, and failure to use normally, and achieve flow The effects of reduced resistance, fast flow rate, and reduced energy loss

Inactive Publication Date: 2006-12-27
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the heat collecting block 6 communicates with the heat insulating section 72 of the heat pipe 7, there is a sudden change in section at the joint 62 between the two, the flow resistance at the joint 62 becomes larger, and the energy loss of the working medium 60 also increases
In addition, the working medium 60 flowing back from the condensation section 74 needs to flow back through the capillary structure on the inner wall of the heat pipe 7. The sudden change in the section makes the distance of the backflow longer, and it is difficult to replenish it in the heat collecting block 6 in time, and it is easy to cause the heat collecting block 6 to dry out and die. Does not work properly

Method used

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  • Heat radiator of heat pipe
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Embodiment Construction

[0015] Please refer to FIG. 3, which is a heat pipe heat dissipation device 100 according to an embodiment of the present invention. The heat pipe heat dissipation device 100 includes a heat pipe 1, a radiator 2 and a fan 3. One end of the heat pipe 1 is connected with a heating electronic component (not shown). The radiator 2 has a plurality of fins, and a mounting hole is opened in the middle part of the plurality of fins for the heat pipe 1 to pass through. The fan 3 is installed on the top or side of the fin to increase the speed of heat exchange.

[0016] See Figure 4 Analyzed from the longitudinal direction: the heat pipe 1 has three working sections: the evaporation section 10, the adiabatic section 12 and the condensation section 14. The evaporation section 10 is in the shape of a flat plate or other shapes adapted to the surface of the electronic component, and the width is greater than the tube diameter d of the heat-insulating section 12. The adiabatic section 12 and t...

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Abstract

The related heat sink for a heat pipe comprises both a heat pipe with an evaporation / condensing / insulation segment and a heat radiator connected to the condensing segment, wherein gradual- shrinkage transitional linking the evaporation and insulation segments, and setting the ratio between last connection curvature radius and section width of insulation segment as 0.2~1.

Description

【Technical Field】 [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device using a heat pipe. 【Background technique】 [0002] With the development of electronic and network communication products, the computing speed of electronic components such as chips in the products is getting faster and faster, and more and more heat is generated. Excessive temperature will cause electrical failure, so the heat must be dissipated. Reduce the failure rate. The existing solutions mainly use a combination of heat pipes, heat sinks and fans to improve heat dissipation efficiency. [0003] Such as figure 1 As shown, it is an existing heat pipe heat dissipation device 8 which includes heat dissipation fins 2, a fan 3, a heat pipe 4 and a heat collecting block 5. The heat pipe 4 has an evaporation section 40, an adiabatic section 42 and a condensation section 44. The evaporating section 40 is embedded in the groove 50 on the heat collecting block 5, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427G06F1/20H05K7/20
CPCF28D15/0266
Inventor 吴国贤
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD