Heat radiator of heat pipe
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
- Publication Date
- 2006-12-27
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
【Technical Field】
[0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device using a heat pipe. 【Background technique】
[0002] With the development of electronic and network communication products, the computing speed of electronic components such as chips in the products is getting faster and faster, and more and more heat is generated. Excessive temperature will cause electrical failure, so the heat must be dissipated. Reduce the failure rate. The existing solutions mainly use a combination of heat pipes, heat sinks and fans to improve heat dissipation efficiency.
[0003] Such as figure 1 As shown, it is an existing heat pipe heat dissipation device 8 which includes heat dissipation fins 2, a fan 3, a heat pipe 4 and a heat collecting block 5. The heat pipe 4 has an evaporation section 40, an adiabatic section 42 and a condensation section 44. The evaporating section 40 is embedded in the groove 50 on the heat collecting block 5, an...