Sputtering equipment
A sputtering device and substrate technology, applied in sputtering coating, vacuum evaporation coating, coating, etc., can solve problems such as uneven material composition
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[0031] Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments provided herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and to convey to those skilled in the art Convey the principles of the invention.
[0032] According to a feature of the invention, the target is divided into target areas and said target areas are attached to the cathode plate. A plurality of gas supply ports are provided in the area between the target areas.
[0033] An inert gas is supplied into the chamber through the plurality of gas supply ports to be evenly distributed to a space between the cathode plate and the anode plate disposed in the chamber, thereby improving the properties of the thin film to be deposited on the substrate. Uniformity...
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