Sputtering equipment

A technology of sputtering device and substrate, applied in sputtering coating, vacuum evaporation coating, coating and other directions, can solve the problem of uneven material composition

Active Publication Date: 2010-05-12
LG DISPLAY CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0016] Also, when the substrate is large, the composition of the material deposited on the substrate is not uniform

Method used

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Embodiment Construction

[0031] The preferred embodiments of the invention will now be described in detail, examples of which are shown in the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments provided herein. ; Rather, these embodiments are provided for thorough and complete disclosure of the invention, and to convey the principle of the invention to those skilled in the art.

[0032] According to a feature of the invention, the target is divided into target areas and said target areas are attached to the cathode plate. A plurality of gas supply ports are provided in the area between the target areas.

[0033] An inert gas is supplied into the chamber through the plurality of gas supply ports to be evenly distributed to a space between the cathode plate and the anode plate disposed in the chamber, thereby improving the properties of the thin film to be deposited on the substrate. Uniformity.

[0034] figure 2...

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Abstract

A sputtering apparatus comprises a substrate unit that includes a substrate on which a target material is deposited in a chamber and a target unit on which a plurality of target sections formed of thetarget material are arranged. The sputtering apparatus further comprises a cathode plate that supplies electric power to surfaces of the plurality of target sections and a plurality of gas supply ports provided on regions between the plurality of target sections.

Description

technical field [0001] The present invention relates to a sputtering device, and more particularly, to a sputtering device having a plurality of gas ports provided on a cathode plate between target regions formed on the cathode plate. Background technique [0002] Generally, a sputtering apparatus is used to deposit a target material on a substrate by accelerating ions using plasma and allowing the ions to collide with a target formed of a target material. [0003] The sputtering process using a sputtering device has the ability to form a thin film at a relatively low temperature of about 400° C. compared to chemical deposition performed at a relatively high temperature. [0004] The sputtering device includes a target unit and a substrate unit arranged in a chamber. The target unit and the substrate unit are respectively connected with the cathode and the anode. When a DC power is applied to the cathode and a high frequency is generated at the anode, electrons are emitted...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34C23C14/54
CPCH01J37/3244H01J37/34C23C14/3464C23C14/34C23C14/54C23C14/3407
Inventor 金成垠李千洙刘桓圭尹炳汉
Owner LG DISPLAY CO LTD
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