Sputtering equipment
A technology of sputtering device and substrate, applied in sputtering coating, vacuum evaporation coating, coating and other directions, can solve the problem of uneven material composition
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0031] The preferred embodiments of the invention will now be described in detail, examples of which are shown in the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments provided herein. ; Rather, these embodiments are provided for thorough and complete disclosure of the invention, and to convey the principle of the invention to those skilled in the art.
[0032] According to a feature of the invention, the target is divided into target areas and said target areas are attached to the cathode plate. A plurality of gas supply ports are provided in the area between the target areas.
[0033] An inert gas is supplied into the chamber through the plurality of gas supply ports to be evenly distributed to a space between the cathode plate and the anode plate disposed in the chamber, thereby improving the properties of the thin film to be deposited on the substrate. Uniformity.
[0034] figure 2...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com