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IC sorter

A technology of classifiers and buffers, which is applied in the direction of instruments, sorting, and measuring devices, and can solve the problems of increased size, increased time, and large footprint of burn-in classifiers

Active Publication Date: 2007-02-14
MIRAE CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the traditional burn-in classifier must have a large footprint, making the size of the burn-in classifier increase
Furthermore, the concatenation between multiple heads of traditional burn-in classifiers increases the time required to retrieve multiple heads

Method used

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Examples

Experimental program
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Embodiment Construction

[0029] Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.

[0030] image 3 is a plan view showing an IC sorter according to an embodiment of the present invention. Figure 4 is shown image 3 A plan view of a variant of an embodiment. Since the IC classifier mainly classifies ICs that have passed the burn-in test, the IC classifier is referred to as a burn-in classifier hereinafter.

[0031] Such as image 3 and 4 As shown, the burn-in sorter 100 includes: a board table 143, a tray loader 131, a tray unloader 133, a DC test buffer 121, an unload buffer 123, a sorting unit 151, a DC failure / loading head 161, an insertion / The head 162, and the unloading / sorting head 163 are disassembled.

[0032] The above-mentioned elements: board table 143, tray loader 131, tray unloader 133, DC test buffer 121, unload buffer 123, sorting unit 151 can all be set on the body 110 of the burn-...

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PUM

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Abstract

The invention provides an IC sorter, a method for sorting a burn-in IC, an IC sorted using the method. The IC sorter includes a board table onto which a burn-in board is loaded, a tray loader and a tray unloader which are spaced from the board table in a first axis direction, a DC test buffer and unloading buffer which are spaced from the board table in a second axis direction, a sorting unit spaced from the board table, having at least one DC failure tray and at least one sorting tray, a DC failure / loading head movable at least among a working location of the tray loader, the DC test buffer and a DC failure tray of the sorting unit, a unloading / sorting head movable at least among a working location of the tray unloader and the unloading buffer and the sorting tray of the sorting unit; and an insertion / removal head movable at least among the DC test buffer, the working area of the board table, and the unloading buffer.

Description

technical field [0001] The present invention relates to an IC sorter and a method for sorting burn-in ICs, and ICs manufactured by the method, and in particular to an IC sorter which loads ICs which have passed the DC test into Burn-in the board, and classify the IC into different grades according to the results of the burn-in test. Background technique [0002] figure 1 is a plan view showing the structure of the burn-in classifier described in Publication No. 1998-0071613. figure 2 is shown setting the figure 1 A view of the operation of the tools on the upper body of the burn-in classifier. Such as figure 1 and 2 As shown, the burn-in classifier includes: board loader 2, board unloader 3, DC failure rejecting unit (DC failure rejecting unit) 4, tray loading unit 5, DC test unit 6, rotation / return unit 7, Y- Workbench 8 , bin pocket unit 9 , pallet unloading unit 10 , and sorting unit 11 . [0003] The plate loader 2 and the plate unloader 3 are arranged on the upp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/344
CPCB07C5/344G01R31/2893
Inventor 金炳佑徐龙镇朴龙根宋虎根
Owner MIRAE CORPORATION