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Circuit board component thermal disassembling equipment and method

A technology for circuit boards and components, which is applied in the field of thermal disassembly equipment for circuit board components, can solve the problems of difficult temperature control, cleaning, and difficulty in maintaining a constant temperature for a long time, and achieves the effect of easy temperature control and large adjustment range

Inactive Publication Date: 2007-03-28
HAIER GRP CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The defect of this prior art is: due to the infrared non-contact heating method, its temperature is not easy to control and it is difficult to maintain a constant temperature for a long time
This prior art also has deficiencies, such as damage and cleaning of components under high temperature, etc.

Method used

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  • Circuit board component thermal disassembling equipment and method
  • Circuit board component thermal disassembling equipment and method
  • Circuit board component thermal disassembling equipment and method

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Embodiment Construction

[0039] Please refer to FIG. 1 , which is a schematic diagram of the thermal disassembly equipment for circuit board components of the present invention.

[0040] The thermal disassembly equipment for circuit board components includes a frame 29 , a heating device 100 , a beating device 200 , a circuit board positioning device 300 , a conveying and collecting device 400 and an electrical control device 500 .

[0041] The frame 29 is used to provide a working platform to support and fix other devices of the thermal disassembly equipment for circuit board components, and has a certain height.

[0042] The heating device 100 is arranged on the upper surface of the frame 29 and has an accommodating space for heating medium for melting solder joints of components on the circuit board (not shown).

[0043] The beating device 200 is fixed on the frame 29 and is used for beating the heated circuit board so that the circuit board vibrates and the components fall off.

[0044] The circu...

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PUM

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Abstract

The present invention discloses a circuit board element and device thermal removing equipment and method. Said equipment includes the following several portions: machine frame, it is used for providing working platform; heating device, it is placed in the machine frame interior, possesses a holding space for holding heating medium, said heating medium can be used for heating circuit board and making the soldered dots of element and device be melted; impacting device, it is fixed on said machine frame, and is used for impacting heated circuit board; circuit board positioning device, it is fixedly set on said machine frame, can be used for holding circuit board and making said circuit board be vertically moved and deflectively moved; conveying and collecting device, it is fixed on said machine frame for conveying and collecting the removed elements and device; and electric control device, it is respectively connected with the above-mentioned heating device, impacting device, circuit board positioning device and conveying and collecting device for controlling and regulating their operation.

Description

technical field [0001] The invention relates to circuit board processing technology, in particular to a thermal disassembly equipment and method for circuit board components. Background technique [0002] With the development of society and science and technology, the application of electronic and electrical products is becoming more and more extensive, which brings great convenience to people's life, work and study. At the same time, discarded electronic products are also increasing. According to data from the European Union, the growth rate of discarded electronic products is three times the average growth rate of other waste. As a result, the treatment technology of waste products has become a topic of concern, because if it is not handled properly, it will bring problems such as environmental pollution and waste of resources. [0003] The electronic components in waste household appliances are the part with the highest resource value and the greatest environmental harm....

Claims

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Application Information

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IPC IPC(8): B09B3/00
CPCY02W30/82
Inventor 尹凤福刘宁刘振宇张鲁楠王袭温雪峰吴国浩
Owner HAIER GRP CORP
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