Substrate processing unit and substrate processing apparatus

A substrate processing device and a substrate processing technology, which can be applied to devices for coating liquid on surfaces, electrical components, electrolysis processes, etc., and can solve problems such as difficulty in releasing substrates and deformation of substrates and substrates
CN1946486AInactive Publication Date: 2007-04-11EBARA CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
EBARA CORP
Publication Date
2007-04-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

A substrate processing unit allows reduction of a space required for the entire substrate processing and reduction of energy required for substrate transportation, by performing a process by using different processing solutions in one substrate processing unit. The substrate processing unit is provided with a vertically movable substrate holding part (72) for holding a substrate (W); an outer tank (70) which surrounds the circumference of the substrate holding part (72); an inner tank (74), which is positioned at a lower part of the substrate holding part (72), arranged inside the outer tank (70) and has a chemical processing part (84) inside; and a spray processing cup (76), which can freely cover an upper edge opening part of the inner tank (74) and has a plurality of spray nozzles (116, 118) for separately spraying at least two types of processing solutions. The outer tank (70) and the inner tank (74) are provided with separate drainage lines (78, 92).
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Description

technical field

[0001] The present invention relates to a substrate processing unit and a substrate processing apparatus, and more particularly to the method of embedding wirings configured to bury conductors (wiring materials) such as copper and silver in fine wiring recesses provided on the surface of a substrate such as a semiconductor wafer. On the exposed surface, for example, a substrate processing unit and a substrate processing apparatus are used to form a protective film by electroless plating (electroless plating).

[0002] The present invention also relates to a substrate holding device and a substrate holding method suitable for use when the surface (surface to be treated) of a substrate is treated with a plating solution or other treatment liquid. Background technique

[0003] As a wiring formation process of a semiconductor device, a process (so-called Damascene Process) of embedding metal (conductor) in trenches and contact holes has been used. This is a proc...

Claims

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