Substrate processing unit and substrate processing apparatus

A substrate processing device and a substrate processing technology, which can be applied to devices for coating liquid on surfaces, electrical components, electrolysis processes, etc., and can solve problems such as difficulty in releasing substrates and deformation of substrates and substrates

Inactive Publication Date: 2007-04-11
EBARA CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, not only a local load is applied to the substrate to deform the substrate, but also the substrate i

Method used

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  • Substrate processing unit and substrate processing apparatus
  • Substrate processing unit and substrate processing apparatus
  • Substrate processing unit and substrate processing apparatus

Examples

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Embodiment Construction

[0079] Embodiments of the present invention will be described below with reference to the drawings. This embodiment shows an example of application to an electroless plating apparatus capable of efficiently forming, for example, a protective film 9 (see FIG. 1 ) using electroless plating on the surface of wiring formed on a substrate. Of course, electrolytic plating equipment, CVD, and the like can also be applied to other substrate processing equipment.

[0080]FIG. 2 is a plan view showing a substrate processing apparatus (electroless plating apparatus) according to an embodiment of the present invention. As shown in FIG. 2 , the substrate processing apparatus includes a rectangular apparatus frame 12 which is detachably detachable, for example, from a transport box 10 such as a SMIF box (sumifbox) that accommodates a plurality of substrates such as semiconductor wafers. Inside the apparatus frame 12, a first substrate transfer robot (robot) 14, a temporary placement table ...

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Abstract

A substrate processing unit allows reduction of a space required for the entire substrate processing and reduction of energy required for substrate transportation, by performing a process by using different processing solutions in one substrate processing unit. The substrate processing unit is provided with a vertically movable substrate holding part (72) for holding a substrate (W); an outer tank (70) which surrounds the circumference of the substrate holding part (72); an inner tank (74), which is positioned at a lower part of the substrate holding part (72), arranged inside the outer tank (70) and has a chemical processing part (84) inside; and a spray processing cup (76), which can freely cover an upper edge opening part of the inner tank (74) and has a plurality of spray nozzles (116, 118) for separately spraying at least two types of processing solutions. The outer tank (70) and the inner tank (74) are provided with separate drainage lines (78, 92).

Description

technical field [0001] The present invention relates to a substrate processing unit and a substrate processing apparatus, and more particularly to the method of embedding wirings configured to bury conductors (wiring materials) such as copper and silver in fine wiring recesses provided on the surface of a substrate such as a semiconductor wafer. On the exposed surface, for example, a substrate processing unit and a substrate processing apparatus are used to form a protective film by electroless plating (electroless plating). [0002] The present invention also relates to a substrate holding device and a substrate holding method suitable for use when the surface (surface to be treated) of a substrate is treated with a plating solution or other treatment liquid. Background technique [0003] As a wiring formation process of a semiconductor device, a process (so-called Damascene Process) of embedding metal (conductor) in trenches and contact holes has been used. This is a proc...

Claims

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Application Information

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IPC IPC(8): B05C9/06B05B15/12B05C3/09B05C11/10B05C15/00C23C18/31C25D17/06H01L21/68
Inventor 胜冈诚司关本雅彦渡边辉行加藤亮横山俊夫铃木宪一小林贤一
Owner EBARA CORP
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