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Synthesis of low normal temperature foamable phenolic resin and method for preparing phenolic foam

A technology of phenolic resin and synthesis method, which is applied in the field of synthesis of phenolic resin and preparation of phenolic foam at low normal temperature, which can solve problems such as environmental pollution and difficult production control, achieve strong controllability, good strength, and reduce investment in fixed assets Effect

Inactive Publication Date: 2013-03-20
苏州美克思新能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above prior art, liquid formaldehyde is used as raw material, and vacuum dehydration is required, the production is difficult to control, and a large amount of phenol-containing waste water is produced, causing environmental pollution

Method used

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  • Synthesis of low normal temperature foamable phenolic resin and method for preparing phenolic foam

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Add 800 kg of phenol and 15 kg of 30% sodium hydroxide solution into a 2-ton reactor, add 320 kg of paraformaldehyde in 7 times at about 80°C, react at 80°C for 30 minutes, then raise the temperature to 95°C for 30 minutes , the temperature was lowered to 85°C and 10 kg of urea was added to react for 50 minutes, and the temperature was lowered to 55°C to obtain a phenolic resin with a viscosity of 2000cp / 25°C.

[0027] Take 100 parts of the above phenolic resin, 3 parts of Tween-80, 5 parts of petroleum ether, 2 parts of xylenesulfonic acid, and 6 parts of p-toluenesulfonic acid, stir at room temperature for 10 seconds at 15°C, and obtain cured phenolic resin after 2 minutes Foam plastic with a density of 40 kg per cubic meter.

Embodiment 2

[0029] Add 800 kg of phenol and 4 kg of 30% potassium hydroxide solution into a 2-ton reactor, add 400 kg of paraformaldehyde in 7 times at around 70°C, react at 70°C for 60 minutes, then raise the temperature to 100°C for 15 minutes , the temperature was lowered to 90°C and 8 kg of urea was added to react for 20 minutes, and the temperature was lowered to 55°C to obtain a phenolic resin with a viscosity of 2000cp / 25°C.

[0030] Take 100 parts of the above phenolic resin, 1 part of silicone oil H-330, 2 parts of n-pentane, 5 parts of xylenesulfonic acid, and 10 parts of p-toluenesulfonic acid, stir at room temperature for 2 minutes at 30°C, and then solidify after 5 minutes Phenolic foam plastic with a density of 40 kg per cubic meter.

Embodiment 3

[0032] Add 800 kg of phenol and 10 kg of zinc acetate into a 2-ton reactor, add 480 kg of paraformaldehyde in 7 times at about 85°C, react at 85°C for 20 minutes, raise the temperature to 97°C for 25 minutes, and cool down to 85°C Add 40 kg of dicyandiamide to react for 100 minutes, cool down to 55°C to obtain phenolic resin with a viscosity of 2000cp / 25°C.

[0033] Take 100 parts of the above phenolic resin, 4 parts of Tween-80, 8 parts of petroleum ether, and 12 parts of p-toluenesulfonic acid, stir at room temperature for 15 minutes at 5°C, and obtain a cured phenolic foam after 3 minutes, with a density of 40 kg per cubic meter.

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Abstract

This invention relates to a preparation of composing low / common temperature foaming phenolic resin and preparing phenol formaldehyde foam, through fractionally add catalytic agent, paraform and amines compound into raw material of C6H5OH phenol, process middle-temperature polycondensation, high--temperature polycondensation, middle-temperature polycondensation, obtain a low / common temperature foaming phenolic resin; This invention can complete foaming rigidification process in 1-5 minutes at 5-30DEG C, thus produce phenol formaldehyde foam which is meticulous and has good strength. Compared with present technology, in this invention technology reaction is stable, controllability is good, investment of fixed assets is largely reduced, no waste liquids. This phenol formaldehyde can be used in situation of scene foam incubation, is useful for extending application of phenol formaldehyde foamed plastics. This invention use diolefine as blowing agent, there is no coefficient of global greenhouse effect.

Description

technical field [0001] The invention relates to a polymer material and a synthesis method thereof, in particular to a method for synthesizing a low-temperature-expandable phenolic resin and preparing a phenolic foam. Background technique [0002] The phenolic foam produced by phenolic resin has the characteristics of low thermal conductivity, non-combustibility, low smoke toxicity, and low value. Phenolic foam has been around for many years and is the most fire resistant of the insulating foams. Despite these advantages, phenolic foams are not widely used in the insulation market. The main reason is that the ideal cured phenolic foam can only be obtained when the phenolic resin is heated, and it is rarely suitable for low temperature casting and spraying phenolic resin. Alkali and metal are used in Chinese patent 03106510 "Production method of phenolic resin used for continuous casting and foaming at room temperature and the resulting resin", 00111275 "Production method of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/10C08J9/00
Inventor 杨金平
Owner 苏州美克思新能源科技有限公司