Method of molding radiator, and locative structure

Abstract

A technology for forming a heat sink consisting of at least one heat conducting tube and multiple groups of heat-sinking finned sheets includes such steps as passing a heat conducting tube through a laminated first group of finned sheets, attaching a locating plate for applying a pressure down to the group of finned sheets, making said heat conducting tube pass through the second group of heat-sinking finned sheets, and attaching a pressing plate to the top finned sheet. It has high heat sinking efficiency. Its locating structure is also disclosed.

Description

technical field [0001] The invention relates to a forming method of a heat sink and its positioning structure, in particular to a forming method and its positioning structure for stably positioning two or more cooling fin groups against being installed on a heat pipe. Background technique [0002] Generally, in order to increase the heat dissipation rate of the heat dissipation fin group, a heat conduction tube will be pierced on the heat dissipation fin group, and capillary tissue or working fluid will be provided in the heat conduction tube to utilize the capillary tissue or working fluid and the heat dissipation on the heat dissipation fin set. The heat source performs heat exchange, so that the cooling fin set can quickly cool down and dissipate heat. [0003] To thread the heat dissipation fin group on the heat pipe, it is first necessary to punch out a plurality of heat dissipation fins, form a ring wall on the outer edge of the heat dissipation fin, and then penetrate...

AI Technical Summary

Problems solved by technology

[0004] However, after the above-mentioned radiating fins are pierced with the heat pipe, when the heat radiating fins are no longer stacked up, since the radiating fins are no longer pierced on the heat pipe, the radiating fins that have been passed on the heat pipe It will form a restoring force that stretches upwards, resulting in insufficient tightness between each heat dissipation fin, so that when it is bumped or squeezed during assembly or transportation, the surface of the heat dissipation fin will often be deformed due to collision, and even the surface of the heat pipe will be deformed. There is a loose phenomenon on the top, so that there is only point or line contact between the heat dissipation fins and the heat pipe, which reduces the overall heat dissipation efficiency

Therefore, in order to improve the above shortcomings, one method is to apply an auxiliary medium between the heat pipe and the heat dissipation fin, such as solder paste hot-melt joint, but this method will inevitably add an additional molding step

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