Chip resistor and its manufacturing method

Abstract

A chip resistor comprises a pair of upper-face electrodes formed on two confronting side portions of a square substrate such that they are positioned on the sides opposed to each other with respect to the center line of the square substrate extending in the direction joining the two side portions, a resistor formed on the square substrate such that it is electrically connected with the paired upper-face electrodes, and a pair of end-face electrodes formed on the end faces of the two confronting side portions of the square substrate and electrically connected with the paired upper-face electrodes. The chip resistor further comprises dummy electrodes formed individually at the two confronting side portions of the square substrate such that they are positioned to correspond to the paired upper-face electrodes in the direction joining the two side portions.

Description

technical field [0001] The present invention relates to a chip resistor used in various electronic devices and a manufacturing method thereof. Background technique [0002] In the conventional chip resistor (Chip Resistor), in order to improve load characteristics such as pulse resistance characteristics by enlarging the area of ​​the resistor body and lengthening the length of the resistor body, as shown in FIG. Between the opposite sides of the square substrate 1, a pair of surface electrodes 2 are formed so that one of them and the other are on opposite sides to each other with respect to the centerline of the square substrate 1 in the direction connecting the opposite sides. , and then, a circuitous resistor body 3 electrically connected to the pair of surface electrodes 2 is formed. [0003] In the above-mentioned conventional chip resistors, since the width of a pair of surface electrodes 2 is made to be less than half of the length of the opposing sides, when forming...

AI Technical Summary

Problems solved by technology

However, in such a general method of manufacturing chip resistors, when surface electrodes 2 or resistors 3 are formed by printing, sputtering, etc., positional deviation occurs, and as shown in FIG. Groove 4a, i.e. the opposite side of square substrate 1, in this state, if by dividing sheet-like substrate 1a along primary dividing groove 4a, obtain a plurality of elongated substrates 1b, and as As shown in FIG. 18 , when the end face electrodes 5 are formed on the opposite end faces of the square substrate 1, there will be a problem that the surface electrodes 2 and the end face electrodes 5 cannot be electrically connected.

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