Thermoelectric device
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[0033] The thermoelectric device shown in FIG. 1 and FIG. 2 was used for the test piece. The first layer 71 composed of the non-electrode nickel-phosphorus plate layer (phosphorus is 2 to 8 wt %) was laminated on the both end sides la of the thermoelectric element 1 by the first non-electrode plating procedure. Furthermore, the first layer 72 composed of the non-electrode nickel-boron plate layer (boron is 1 wt %) was laminated on the first layer 71 by the second nonelectrode plating procedure.
[0034] The three kinds of the first layer 71 were prepared for the evolution with the thickness of 0.5 to 1.0 .mu.m, 1.0 to 5.0 .mu.m and 5.0 to 10.0 .mu.m. The two kinds of the second layer 72 were also prepared with the thickness of 0.1 to 0.5 .mu.m and 0.5 to 1.0 .mu.m.
[0035] In order to evaluate the defect of soldering, the burn-in test which fed electric current of 2 [A] to each test piece was performed. After the burn-in test the cool-heat test was performed to hold the test pieces at th...
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