Probe stylus

a technology of probe stylus and probe card, which is applied in the direction of measurement devices, semiconductor/solid-state device testing/measurement, instruments, etc., can solve the problems of difficult setting of the prior art probe stylus onto the probe card, and the tendency of the probe card to warp

Inactive Publication Date: 2002-01-31
MITSUBISHI ELECTRIC CORP
View PDF0 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the setting of the probe styluses of the prior art onto a probe card are difficult, when a large number of pads are disposed in a semiconductor device.
Another drawback is that a probe card tends to warp, when perpendicular type probe styluses contact with the pads disposed in a semiconductor device.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Probe stylus
  • Probe stylus
  • Probe stylus

Examples

Experimental program
Comparison scheme
Effect test

second embodiment

[0098] SECOND EMBODIMENT

[0099] In a probe stylus according to the first embodiment, the first and second electrically conductive members 2, 3 are connected at their tip. On the other hand, in a probe stylus according to the second embodiment of the present invention, the first and second electrically conductive members are not connected at their tip. And at an inspection of a semiconductor device, they are connected to each other through a pad disposed in a semiconductor device. The other feature is similar to that of the first embodiment.

[0100] FIG. 7 shows that the probe stylus 1a is contacting with a pad 5 disposed in a semiconductor device. Referring to the figure, reference numerals 1a, 2a, 3a denote a probe stylus, a first electrically conductive member, and a second electrically conductive member, respectively. The first and second electrically conductive members 2a, 3a are connected by an insulating member 4a arranged between them. Reference numeral 5 denotes a pad disposed ...

third embodiment

[0107] THIRD EMBODIMENT

[0108] The first and second electrically conductive members 2,3 in a probe stylus according to the first embodiment are so arranged that one of them is positioned over the other. On the other hand, the first and second electrically conductive members in a probe stylus according to the third embodiment are arranged side by side. The other features of a probe stylus according to the third embodiment are similar to that of the first embodiment.

[0109] FIG. 9 and 10 show that a probe stylus 1b contacts with a pad 5 disposed in a semiconductor device. Referring to the figures, reference numerals 1b, 2b, 3b denote a probe stylus, a first electrically conductive member, and a second electrically conductive member, respectively. The first and second electrically conductive members 2b, 3b are connected by an insulating member 4b arranged between them. Reference numeral 5 denotes a pad disposed in a semiconductor.

[0110] The structure of a probe card having probe stylus 1...

fourth embodiment

[0113] FOURTH EMBODIMENT

[0114] In a probe stylus according to the third embodiment, the first and second electrically conductive members 2b, 3b are connected at their tip. On the other hand, in a probe stylus according to the fourth embodiment of the present invention, the first and second electrically conductive members are not connected at their tip. And at an inspection of a semiconductor device, they are connected to each other through a pad disposed in the semiconductor device. The other feature is similar to that of the third embodiment.

[0115] FIG. 13 shows that the probe stylus 1c is contacting with a pad 5 disposed in a semiconductor device. Referring to the figures, reference numerals 1c, 2c, 3c denote a probe stylus, a first electrically conductive member, and a second electrically conductive member, respectively. The first and second electrically conductive members 2c, 3c are connected by an insulating member 4c arranged between them. Reference numeral 5 denotes a pad dis...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a probe stylus 1 for an inspection of semiconductor device in a state of wafer. When a large number of pad 5 are disposed in a semiconductor device, setting of the probe styluses 1 onto a probe card, on which a semiconductor to be inspected shall be mounted, is difficult. An objet of the present invention is to improve the form of the probe stylus to solve this problem. The object is attained by a probe stylus according to the present invention. The probe stylus 1 is comprised of a first electrically conductive member 2, a second electrically conductive member 3, and an insulating member 4 disposed between the first and second electrically conductive members 2,3, wherein the first and second electrically conductive members 2,3 have a form of a needle and they form a single needle. In an embodiment, the first and second electrically conductive members have a half round cross section. In another embodiment, each of the first and second electrically conductive members has a resilient portion at their tip portion. In another embodiment, the first electrically conductive member is covered with the insulating member, and the insulating member is covered with the second electrically conductive member. In further another embodiment, a slit is disposed between the first and second electrically conductive members.

Description

BACKBROUND OF THE INVENTION[0001] 1. Field of the Invention[0002] The present invention relates to a probe stylus for inspecting a semiconductor at a wafer state.[0003] 2. Description of the Prior Art[0004] A probe stylus in the prior art is constituted as a single electrically conductive needle. In a high precise inspection of a semiconductor device at a wafer state, probe styluses for forcing and probe styluses for sensing are connected to pads disposed in a semiconductor. And these probe styluses are connected to form a Kelvin connection. In such a probe stylus, a cantilever type probe stylus and a perpendicular type probe stylus are known. The cantilever type probe stylus contacts obliquely with a pad disposed in a semiconductor device, and the perpendicular type probe stylus contacts perpendicularly with a pad, at an inspection of a semiconductor.[0005] At an inspection of an I / O of a semiconductor device, for example, a high speed logic element, when an output data of a driver...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(United States)
IPC IPC(8): G01R1/067H01L21/66
CPCG01R1/06716G01R1/06738G01R1/0675G01R1/06761
InventorNODA, HIROSHI
OwnerMITSUBISHI ELECTRIC CORP