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Method and apparatus for handling arrayed components

a technology for arrayed components and arrayed components, which is applied in the direction of electrical apparatus, television systems, color signal processing circuits, etc., can solve the problems of increasing the occupied area of the apparatus, increasing the cost of the apparatus itself, and increasing the running cost of the clean room heating and electricity

Inactive Publication Date: 2004-09-23
SHIDA SATOSHI +5
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0022] a component housing section which makes it possible to handle the component in a packing style as being received in a component housing member for next-step handling; and

Problems solved by technology

Larger-sized apparatuses cause not only increased cost of the apparatuses themselves, but also causes higher running cost in heating and electricity of a clean room in which the apparatuses are used, which, in one example, equals as high as 30 million yen a month in the case of a clean room with area of 600 m.sup.2, bringing about a serious new issue of increased occupied area of the apparatus.

Method used

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  • Method and apparatus for handling arrayed components
  • Method and apparatus for handling arrayed components
  • Method and apparatus for handling arrayed components

Examples

Experimental program
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first embodiment

[0098] The following description discusses a method and apparatus for handling arrayed components according to the first embodiment of the present embodiment, and more specifically, a feeding method and device of arrayed components, a transfer device of arrayed components with use of the feeding device, and a housing device of arrayed components, with reference to FIGS. 1 to 8, FIG. 16, FIG. 17, and FIG. 19 for understanding of the present invention. It is noted that each operation of the apparatus for handling arrayed components in the first embodiment is controlled by a control unit 48 as shown in FIG. 19.

[0099] The first embodiment exemplifies the case where a semiconductor wafer 1 as mainly shown in FIGS. 1 and 3 is diced on a dicing sheet 4 into individual pieces, and a semiconductor element 2 in a state of being arrayed in two orthogonal directions is treated as one example of an arrayed component, which is picked up one by one by a component handling tool that holds or releas...

second embodiment

[0134] A method and apparatus for handling arrayed components according to the second embodiment of the present invention shown in FIG. 8, and more specifically, a feeding method and device of arrayed components, a transfer device of arrayed components with use of the feeding device, and a housing device of arrayed components are structured such that a push-up pin 8 is supported by a push-up pin two-direction moving device 71 which moves the push-up pin 8 on the frame 16 in each X and Y direction, for moving the push-up pin 8 in the X and Y two directions. The push-up pin two-direction moving device 71 is composed of X and Y tables, and is disposed on the frame 16 so as not to interfere with the two-direction moving device 10 nor the frame 26 as shown in FIG. 8. The push-up pin two-direction moving device 71 is composed of an X table 73 to be moved on the frame 16 in the X direction by an X-direction driving motor 72, and a Y table 75 to be moved on the X table 73 in the Y direction...

third embodiment

[0138] The following description discusses a method and apparatus for handling arrayed components according to the third embodiment of the present invention, and more specifically, a feeding method and device of arrayed components, a transfer device of arrayed components with use of the feeding device, and a housing device of arrayed components, with reference to accompanied drawings for understanding of the present invention. It is understood that the third embodiment described below is one embodiment of the present invention, and the technical scope of the present invention is not limited thereby. Since the third embodiment has many characteristics in common with the first embodiment, it will be described with reference to drawings and description of the first embodiment in an appropriate manner.

[0139] Before description of the third embodiment of the present invention proceeds, the background thereof will be described first.

[0140] Semiconductor elements, such as IC chips, are for...

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PUM

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Abstract

Handling of each arrayed component is implemented in pickup operation within a movement range of a supporting body against the size of a supporting region of the arrayed component smaller than that in the prior art. Each component supported on a supporting body in array is moved to a pickup position with a movement of the supporting body in X and Y two component array directions, and is fed to pickup operation by a tool with push-up operation by a push-up pin involved, in which after each unit region (D1 to D4) dividedly set around the pickup position of the supporting body is positioned at a pickup standby position by rotation of the supporting body in a switching manner, the component in the positioned unit region is moved in each component array direction of the supporting body and fed to pickup operation in sequence.

Description

[0001] This is a divisional application of Ser. No. 10 / 069,401, filed Feb. 26, 2002, which is the National Stage of International Application No. PCT / JP00 / 05672, filed Aug. 24, 2000.[0002] The present invention relates to a method and apparatus for handling arrayed components that feeds arrayed components composed of a plurality of components in array, and more particularly, relates to a method and apparatus for handling arrayed components including a feeding method and device of arrayed components, a transfer device with use of the feeding device, and a housing device. More specifically, the present invention relates to, for example, a method and device for feeding arrayed semiconductor elements so that a number of diced semiconductor elements arrayed in vertical and horizontal direction are picked up one by one, a transfer device for transferring picked-up semiconductor elements to other places, and a housing device for housing the picked-up semiconductor elements in various housi...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/301
CPCH01L21/67271H01L21/67144
Inventor SHIDA, SATOSHIKANAYAMA, SHINJISHIMIZU, TAKASHITAKAHASHI, KENJIINUTSUKA, RYOJIYOSHIDA, HIROYUKI
Owner SHIDA SATOSHI