Heat sink element coupling structure

a technology of heat sink elements and coupling structures, which is applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of serious limitations in profile variety and performance range, and cannot be conjoined to the heat sink mounting plate, and achieves the effect of easy loosing nor shifting during assembly
US20050022972A1Inactive Publication Date: 2005-02-03CHENG TUNG CHEN +1

Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
CHENG TUNG CHEN
Publication Date
2005-02-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

An improved heat sink element coupling structure comprised of a minimum of one or more folded appendages that are formed by bending along the upper or lower lateral edges, the middle, or other suitable position of a single heat sink element or along the two sides of one lateral edge or middle position of a single heat sink element; an opening disposed at the confluence of the folded appendage and the single heat sink element plate that penetrates the folded appendage to form a perforated construct; and a linking member that extends outward from the folded appendage and, furthermore, is positioned at the distal extremity of the single heat sink element plate. The features of the present invention include the following innovations. The linking member also has two lock tabs along its two sides that extend from the two sides at the leading extremity of the linking member. During interconnection, the lock tabs along the two sides of the linking member on single heat sink elements are articulated into an O shape and engaged into the opening of another immediately adjacent single heat sink element. Furthermore, the linking member and the two lock tabs at its two sides are formed into a horizontal S shape or an inverted horizontal S-shaped arrangement such that they are crimped onto the other single heat sink element plate and also firmly secured against the two lateral edges of the opening to prevent unintentional dislodging.
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Description

BACKGROUND OF THE INVENTION

[0001] 1) Field of the Invention

[0002] The invention herein relates to heat dissipation fixtures, specifically an improved heat sink element coupling structure capable of total mechanical engagement that cannot be unintentionally dislodged, the coupling structure of which is disposed on a single side of each heat sink element to interconnect a plurality thereof into a heat sink.

[0003] 2) Description of the Prior Art

[0004] In conventional “assembly-type” heat sinks, such as those disclosed in patent application No. 407753, 460110, 468931, 484704, and 516794 in the Taiwan Patent Bulletin, the coupling structure for achieving interconnection consists of a “stack fit” approach. As a result, a coupling structure must be disposed at the upper and lower edge of each individual heat sink element plate so they can be interconnected into a heat sink. If the coupling structure is only disposed on the lower lateral edge of every individual heat sink element plate,...

Claims

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