Heat sink element coupling structure
Patent Information
- Authority / Receiving Office
- US · United States
- Current Assignee / Owner
- CHENG TUNG CHEN
- Publication Date
- 2005-02-03
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
BACKGROUND OF THE INVENTION
[0001] 1) Field of the Invention
[0002] The invention herein relates to heat dissipation fixtures, specifically an improved heat sink element coupling structure capable of total mechanical engagement that cannot be unintentionally dislodged, the coupling structure of which is disposed on a single side of each heat sink element to interconnect a plurality thereof into a heat sink.
[0003] 2) Description of the Prior Art
[0004] In conventional “assembly-type” heat sinks, such as those disclosed in patent application No. 407753, 460110, 468931, 484704, and 516794 in the Taiwan Patent Bulletin, the coupling structure for achieving interconnection consists of a “stack fit” approach. As a result, a coupling structure must be disposed at the upper and lower edge of each individual heat sink element plate so they can be interconnected into a heat sink. If the coupling structure is only disposed on the lower lateral edge of every individual heat sink element plate,...