Substrate support for in-situ dry clean chamber for front end of line fabrication

Abstract

A substrate support assembly and method for supporting a substrate are provided. In at least one embodiment, the support assembly includes a body having one or more fluid conduits disposed therethrough, and a support member disposed on a first end of the body. The support member includes one or more fluid channels formed in an upper surface thereof, wherein each fluid channel is in communication with the one or more of the fluid conduits. The support assembly also includes a cooling medium source in fluid communication with the one or more fluid conduits, and a first electrode having a plurality of holes formed therethrough. The first electrode is disposed on the upper surface of the support member such that each of the plurality of holes is in fluid communication with at least one of the one or more fluid channels formed in the upper surface of the support member.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional of copending U.S. patent application Ser. No. 11 / 063,645 filed on Feb. 22, 2005, which claims benefit of U.S. provisional patent application Ser. No. 60 / 547,839, filed Feb. 26, 2004, which are herein incorporated by reference.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] Embodiments of the present invention generally relate to semiconductor processing equipment. More particularly, embodiments of the present invention relate to a chemical vapor deposition (CVD) system for semiconductor fabrication and in situ dry cleaning methods using the same. [0004] 2. Description of the Related Art [0005] A native oxide typically forms when a substrate surface is exposed to oxygen. Oxygen exposure occurs when the substrate is moved between processing chambers at atmospheric conditions, or when a small amount of oxygen remaining in a vacuum chamber contacts the substrate surface. Native oxides may...

AI Technical Summary

Problems solved by technology

Native oxides may also result if the substrate surface is contaminated during etching.

Native oxides typically form an undesirable film on the substrate surface.

Native oxide films are usually very thin, such as between 5 and 20 angstroms, but thick enough to cause difficulties in subsequent fabrication processes.

Such difficulties usually affect the electrical properties of semiconductor devices formed on the substrate.

For example, a particular problem arises when native silicon oxide films are formed on exposed silicon containing layers, especially during processing of Metal Oxide Silicon Field Effect Transistor (“MOSFET”) structures.

Silicon oxide films are electrically insulating and are undesirable at interfaces with contact electrodes or interconnecting electrical pathways because they cause high electrical contact resistance.

Native silicon oxide films at the interface between the substrate and the metal reduce the compositional uniformity of the suicide layer by impeding the diffusional chemical reaction that forms the metal silicide.

This results in lower substrate yields and increased failure rates due to overheating at the electrical contacts.

However, sputter etch processes can damage delicate silicon layers by physical bombardment.

Wet etch processes such as this, however, are disadvantageous in today's smaller devices where the aspect ratio exceeds 4:1, and especially where the aspect ratio exceeds 10:1.

As a result, the removal of the native oxide film is incomplete.

Similarly, a wet etch solution, if successful in penetrating a feature of that size, is even more difficult to remove from the feature once etching is complete.

One disadvantage to using fluorine-containing gases, however, is that fluorine is typically left behind on the substrate surface.

Fluorine atoms or fluorine radicals left behind on the substrate surface can be detrimental.

For various reasons, this reactive fluorine processing sequence is not desirable.

Namely, wafer throughput is greatly diminished because of the time involved to transfer the wafer.

Also, the wafer is highly susceptible to further oxidation or other contamination during the transfer.

Moreover, the cost of ownership is doubled because two separate chambers are needed to complete the oxide removal process.

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