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Step and flash imprint lithography

a lithography and imprint technology, applied in the field of using lithography techniques, can solve the problems of microelectronic device processing, difficult to form some structures in varying pattern densities, and potential undesirable etch selectivity

Inactive Publication Date: 2005-10-27
BOARD OF RGT THE UNIV OF TEXAS SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of this material, however, may be disadvantageous in that it is potentially difficult to form some structures in varying pattern densities.
Moreover, it is perceived that the etch selectivity may be potentially undesirable for common microelectronic device processing.

Method used

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  • Step and flash imprint lithography
  • Step and flash imprint lithography
  • Step and flash imprint lithography

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Embodiment Construction

[0012] The present invention now will be described more fully hereinafter with reference to the accompanying drawings and specification in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity. Like numbers refer to like elements throughout. It will also be understood that when a layer is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present.

[0013] In one aspect, the invention relates to at least one method of forming a relief image in a structure comprising a substrate and a transfer layer formed the...

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Abstract

A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] The present application is a continuation of U.S. patent application Ser. No. 10 / 978,285, filed Oct. 29, 2004, which is a continuation of U.S. patent application Ser. No. 10 / 806,051, filed Mar. 22, 2004, which is a divisional application of U.S. patent application Ser. No. 09 / 908,765, now U.S. Pat. No. 6,719,915, which is a continuation patent application of U.S. patent application Ser. No. 09 / 266,663, now U.S. Pat. No. 6,334,960, all having Carlton Grant Willson and Matthew Earl Colburn listed as inventors.STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] The U.S. Government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided for by the terms of MDA-972-97-3-0007 awarded by the Defense Advanced Research Projects Agency (DARPA).FIELD OF THE INVENTION [0003] The invention generally relates to using lithography tec...

Claims

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Application Information

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IPC IPC(8): B29C31/00G03F7/038B81C1/00G03F7/00H01L21/027H01L21/30H01L21/302H01L21/3065H05K3/06
CPCB29C43/003B29C43/021B29C2043/025B82Y10/00Y10S977/897G03F7/0002H05K3/061Y10S977/887B82Y40/00
Inventor WILLSON, CARLTON GRANTCOLBURN, MATTHEW E.
Owner BOARD OF RGT THE UNIV OF TEXAS SYST