Thermal control system for rack mounting

Abstract

A thermal control system of a 3U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and / or a serial communication interfaces. This Abstract is provided to comply with rules requiring an Abstract that allows a searcher or other reader to quickly ascertain subject matter of the technical disclosure. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).

Description

RELATED APPLICATIONS[0001] The present application claims priority to U.S. Provisional Patent Application No. 60 / 601,013 filed Aug. 12, 2004, and incorporates by reference for all purposes the entire disclosures of U.S. patent application Ser. No. 09 / 328,183 filed Jun. 8, 1999 and U.S. Pat. No. 6,462,949 entitled “Electronic Enclosure Cooling System.”BACKGROUND OF THE INVENTION [0002] 1. Technical Field [0003] The present invention relates to thermal control systems, and more particularly, but not by way of limitation, to low profile, rack mounted thermal control systems for cooling or heating equipment disposed in or in the vicinity of an equipment rack. [0004] 2. Background of the Related Art [0005] As the evolution of computers continued from mini-computers that filled entire rooms with equipment to PC modules similar to the personal computer known today, rack mounted equipment decreased in popularity. However, with the introduction of new electronic equipment, such as slice serv...

AI Technical Summary

Benefits of technology

[0017] In yet another embodiment, the above-described invention includes the ability to customize the design of the 3U system and allow on the order of three heat transfer assemblies to effect cooling and

Problems solved by technology

By mounting multiple components in a rack heat is increased, thereby causing deterioration and possible failure of many of the components.

In addition, many components, such as laser systems, perform poorly when subject to vibration and noise that many compressor-based chillers exhibit.

It should be noted, however, that such height is critical to space considerations of the overall rack.

These compressor-based systems typically weigh over seventy pounds and create unwanted vibrations.

When rack-mounted systems that are vibrationally sensitive require precise temperature control, a compressor based system cannot be used.

Thus, a more technologically complex scenario can evolve.

A simple chiller is generally not capable of also performing a heating function without adding resistive elements.

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