Thermal control system for rack mounting

US20060034053A1Inactive Publication Date: 2006-02-16THERMOTEK
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
THERMOTEK
Publication Date
2006-02-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

A thermal control system of a 3U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and / or a serial communication interfaces. This Abstract is provided to comply with rules requiring an Abstract that allows a searcher or other reader to quickly ascertain subject matter of the technical disclosure. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).
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Description

RELATED APPLICATIONS

[0001] The present application claims priority to U.S. Provisional Patent Application No. 60 / 601,013 filed Aug. 12, 2004, and incorporates by reference for all purposes the entire disclosures of U.S. patent application Ser. No. 09 / 328,183 filed Jun. 8, 1999 and U.S. Pat. No. 6,462,949 entitled “Electronic Enclosure Cooling System.”BACKGROUND OF THE INVENTION

[0002] 1. Technical Field

[0003] The present invention relates to thermal control systems, and more particularly, but not by way of limitation, to low profile, rack mounted thermal control systems for cooling or heating equipment disposed in or in the vicinity of an equipment rack.

[0004] 2. Background of the Related Art

[0005] As the evolution of computers continued from mini-computers that filled entire rooms with equipment to PC modules similar to the personal computer known today, rack mounted equipment decreased in popularity. However, with the introduction of new electronic equipment, such as slice serv...

Claims

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