Method of resin-seal-molding electronic component and apparatus therefor

a technology of electronic components and resins, which is applied in the direction of electrical equipment, basic electric elements, semiconductor devices, etc., can solve the problems of inability to efficiently release molded products, inability to bond to the surface of the mold for resin molding, and damage to the molded product body (resin-seal-molded body). , to achieve the effect of simplifying the mold structur
US20070072346A1Inactive Publication Date: 2007-03-29TOWA
8 Cites 7 Cited by

Patent Information

Authority / Receiving Office
US ยท United States
Patent Type
Applications(United States)
Current Assignee / Owner
TOWA
Publication Date
2007-03-29
Estimated Expiration
Not applicable ยท inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A mold for resin-seal-molding an electronic component is constituted by a first mold and a second mold. At a mold face (PL face) of the molds, a substrate supply-set surface having a flat shape without a step is provided. A pot block is joined with and separated from a side position of the mold intersecting perpendicularly with the mold face (PL face) of the molds. In a state where the mold face and the pot block are joined, a molten resin material in the pot block is injected into a cavity. The overall structure of the mold for resin-seal-molding an electronic component mounted on the substrate is simplified. Additionally, when resin-seal-molding the electronic component, a problem of variation in the thicknesses of the substrates is solved. Thus, resin flash formation on the substrate surface is prevented.
Need to check novelty before this filing date? Find Prior Art

Description

[0001] This nonprovisional application is based on Japanese Patent Application No. 2005-280292 filed with the Japan Patent Office on Sep. 27, 2005, the entire contents of which are hereby incorporated by reference. BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a method of seal-molding an electronic component of a relatively small size such as a semiconductor chip by a resin material, and to an apparatus for resin-seal-molding an electronic component used for implementing the method.

[0004] 2. Description of the Background Art

[0005] Recently, an improvement has particularly been required in the function of a semiconductor package wherein an electronic component of a relatively small size such as a semiconductor chip is seal-molded by a resin material (hereinafter simply referred to as a semiconductor package). Specifically, for example a so-called MAP type large substrate has strongly been required to have higher integration, hi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More