Method for improved high current component interconnections

Abstract

A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.

Description

[0001] This application is a divisional of prior application Ser. No. 10 / 427,681, filed Apr. 30, 2003.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates generally to the field of electronic printed circuit boards, and more specifically to forming solder interconnections on the printed circuit board. [0004] 2. Discussion of Related Art [0005] Demands on power delivery have increased as part of the effort to achieve higher performance in logic silicon products. Higher currents, better current transient response and bypass capacitance are frequently the key parameters sought in successful power delivery design. One potential power delivery bottleneck is in the printed circuit board-component interface. For example, a power MOSFET-board interface can introduce a substantial amount series resistance and thereby limit the effectiveness of the power delivery system. Currently, many standard off-the-shelf ball grid array (BGA) MOSFET components...

AI Technical Summary

Problems solved by technology

One potential power delivery bottleneck is in the printed circuit board-component interface.

For example, a power MOSFET-board interface can introduce a substantial amount series resistance and thereby limit the effectiveness of the power delivery system.

These smaller interconnects are highly resistive, and can limit the effectiveness of the power delivery system.

In addition, the resulting high current density can result in excessive parasitic inductance.

This may not provide for an optimal solder interconnection, however.

Solder voids 124 and solder separation will result from insufficient solder volume.

However, this requires a change in product design by the component vendor to accommodate the additional solder on the component package.

Because of limitations on the amount of solder paste that can practically be applied to the printed circuit board, the solder paste alone provides insufficient solder volume to entirely fill the solder interconnections 123.

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