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Clip module and heat-dissipation apparatus having the same

a technology of heat dissipation apparatus and clip module, which is applied in the direction of lighting and heating apparatus, semiconductor devices, and semiconductor/solid-state device details. it can solve the problems of high product cost of conventional clip modules b>130/b>, limited space around the heat sink, and high cost of plastics of cam pressing structures

Inactive Publication Date: 2008-07-24
AMA PRECISION INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]One objective of the invention is to provide a clip module and heat-dissipation apparatus having the same to provide a clip module with a low cost.
[0010]Another objective of the invention is to provide a clip module and heat-dissipation apparatus having the same. The clip module can assemble the heat sink to the heat source successfully and will not interfere with electronic elements around the heat sink easily.
[0017]In the heat-dissipation apparatus of the invention, the components (the body, fastener and pressing structure) of clip module of the invention are, for example, sheet metal parts with simple structure. Therefore, the clip module of the invention has a low product cost. Moreover, since the components (the body, fastener and pressing structure) of the clip module are sheet metal parts with simple structure, the clip module has an advantage of being assembled easily. On the other hand, in order to assemble the heat sink on the heat source successfully, the pivot direction of the pressing structure of the invention is parallel to the direction of the axis of symmetry of body. Therefore, the pressing structure pivotally connected to the fastener will not interfere with the electronic elements around the heat sink because of the space limitation. In other words, the clip module of the invention can fix the heat sink on the heat source successfully.

Problems solved by technology

The material of the cam pressing structure 136 is plastic which is expensive.
Therefore, the conventional clip module 130 has a high product cost.
However, in the computer, the space around the heat sink 120 is limited.
Thus, the heat sink cannot be assembled to the heat source 10 easily.

Method used

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  • Clip module and heat-dissipation apparatus having the same
  • Clip module and heat-dissipation apparatus having the same
  • Clip module and heat-dissipation apparatus having the same

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Embodiment Construction

[0028]FIG. 2A is a three-dimensional schematic diagram showing a heat-dissipation apparatus provided on a heat source in a preferred embodiment of the invention, and FIG. 2B is an exploded diagram showing the heat-dissipation apparatus and the heat source shown in FIG. 2A. Refer to FIG. 2A and FIG. 2B simultaneously. A heat-dissipation structure 200 in the embodiment is suitable to dissipate the heat generated by the source 22 on a circuit board 20. The heat-dissipation structure 200 includes a retention module (RM) 210, a heat sink 220 provided on a heat source 22, and a clip module 230. In the embodiment, utilizing the lever principle, the clip module 230 can fasten the heat sink 220 on the heat source 22 steadily. The detail process concerning how to fasten the heat sink 220 on the heat source 22 by the clip module 230 in the embodiment will be described hereinbelow.

[0029]In the embodiment, the RM 210 is provided on the circuit board 20 and around the heat source 22, and the RM 2...

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Abstract

A heat-dissipation apparatus is disclosed. The heat-dissipation apparatus is suitable to dissipate heat generated by a heat source and includes a retention module (RM) around the heat source, a heat sink provided at the heat source, and a clip module. The clip module includes a body, a fastener, and a pressing structure. One end of the body is fastened on the RM, and the heat-sink is pressed on the heat source by the body. The fastener is provided at the other end of the body. One end of the fastener is fastened on the RM, and the pressing structure is pivotally connected to the other end of the fastener along a rotating axis. The pressing structure is suitable to rotate to be fastened at a fixing part of the fastener, so that the body is pressed by the pressing structure.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 96102036, filed on Jan. 19, 2007. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to a clip module and, more particularly, to a clip module and a heat-dissipation apparatus having the same.[0004]2. Description of the Related Art[0005]In recent years, with the rapid development of the science and technology, various electronic components such as chipsets have more and more transistors. Therefore, working temperature of electronic components becomes higher and higher. The heat dissipation of a central process unit (CPU) of a computer, for example, is always worth studying. To prevent a CPU from overheating which will make the computer break down temporarily or permanently, the computer need suf...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCH01L23/4093H01L2924/0002H01L2924/00
Inventor YAN, KUNG-JEN
Owner AMA PRECISION INC