Clip module and heat-dissipation apparatus having the same
a technology of heat dissipation apparatus and clip module, which is applied in the direction of lighting and heating apparatus, semiconductor devices, and semiconductor/solid-state device details. it can solve the problems of high product cost of conventional clip modules b>130/b>, limited space around the heat sink, and high cost of plastics of cam pressing structures
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[0028]FIG. 2A is a three-dimensional schematic diagram showing a heat-dissipation apparatus provided on a heat source in a preferred embodiment of the invention, and FIG. 2B is an exploded diagram showing the heat-dissipation apparatus and the heat source shown in FIG. 2A. Refer to FIG. 2A and FIG. 2B simultaneously. A heat-dissipation structure 200 in the embodiment is suitable to dissipate the heat generated by the source 22 on a circuit board 20. The heat-dissipation structure 200 includes a retention module (RM) 210, a heat sink 220 provided on a heat source 22, and a clip module 230. In the embodiment, utilizing the lever principle, the clip module 230 can fasten the heat sink 220 on the heat source 22 steadily. The detail process concerning how to fasten the heat sink 220 on the heat source 22 by the clip module 230 in the embodiment will be described hereinbelow.
[0029]In the embodiment, the RM 210 is provided on the circuit board 20 and around the heat source 22, and the RM 2...
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