Protection of polymer surfaces during micro-fabrication

a polymer surface and micro-fabrication technology, applied in the field of micro-fabrication, can solve problems such as interoperability problems in completed devices

Inactive Publication Date: 2008-09-11
GLOBALFOUNDRIES INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the photolithographic process can contaminate the surfaces of un

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  • Protection of polymer surfaces during micro-fabrication
  • Protection of polymer surfaces during micro-fabrication
  • Protection of polymer surfaces during micro-fabrication

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[0031]The media layer selected was a polyarylether ketone polymer containing additional acetylenic functionality for thermal, photochemical or ionizing radiation crosslinking. The polymer contained about 15 monomer units on average yielding a molecular weight of about 4,000 Daltons. A 5 weight % solution of the polymer using cyclohexanone solvent was used for spin coating a 100 nm thick polymer film on a silicon wafer. The polymer film was cured for 1 hour in a nitrogen atmosphere at 380 C in order to activate the cross-linking reaction between the ethynyl moieties of the polyarylether ketone.

[0032]Poly-vinyl-alcohol with molecular weight of about 72,000 Daltons, purchased from Fluka, was dissolved in purified water to form a 5% by weight solution. The solution was spin coated onto the media layer to form a 300 nm thick media protection layer after curing (30 minutes at 90° C.). The PVA media protection layer remained on the polymer throughout all processing steps involving repeated...

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Abstract

A method of protecting a polymeric layer from contamination by a photoresist layer. The method includes: (a) forming a polymeric layer over a substrate; (b) forming a non-photoactive protection layer over the polymeric layer; (c) forming a photoresist layer over the protection layer; (d) exposing the photoresist layer to actinic radiation and developing the photoresist layer to form a patterned photoresist layer, thereby exposing regions of the protection layer; (e) etching through the protection layer and the polymeric layer where the protection layer is not protected by the patterned photoresist layer; (f) removing the patterned photoresist layer in a first removal process; and (g) removing the protection layer in a second removal process different from the first removal process.

Description

FIELD OF THE INVENTION[0001]The present invention relates to the field of micro-fabrication; more specifically, it relates a method of protecting a polymer surface during micro- fabrication of a device.BACKGROUND OF THE INVENTION[0002]Micro-fabrication often requires photolithographic processing and etching to form structures. However, the photolithographic process can contaminate the surfaces of underlying materials causing operability problems in the completed devices. Accordingly, there exists a need in the art to overcome the deficiencies and limitations described hereinabove.SUMMARY OF THE INVENTION[0003]A first aspect of the present invention is a method comprising: (a) forming a polymeric layer over a substrate; (b) forming a non-photoactive protection layer over the polymeric layer; (c) forming a photoresist layer over the protection layer; (d) exposing the photoresist layer to actinic radiation and developing the photoresist layer to form a patterned photoresist layer, ther...

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Application Information

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IPC IPC(8): H01L21/311
CPCG11B9/149B82Y10/00Y10S438/928
Inventor DRECHSLER, UTEDUERIG, URS T.FROMMER, JANE ELIZABETHGOTSMANN, BERND W.HEDRICK, JAMES LUPTONKNOLL, ARMIN W.KRAUS, TOBIASMILLER, ROBERT DENNIS
Owner GLOBALFOUNDRIES INC
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