Cooling Module
Patent Information
- Authority / Receiving Office
- US · United States
- Current Assignee / Owner
- PARTNER TECH
- Publication Date
- 2009-06-18
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
[0001] This application claims the benefit from the priority of Taiwan Patent Application No. 096148193 filed on Dec. 17, 2007, the contents of which are herein incorporated by reference in their entirety.CROSS-REFERENCES TO RELATED APPLICATIONS
[0002] Not applicable.BACKGROUND OF THE INVENTION
[0003] 1. Field of the Invention
[0004] The present invention provides a cooling module, and particularly, relates to a cooling module for cooling at least one heat source disposed inside a metal housing of a calculation processing apparatus.
[0005] 2. Descriptions of the Related Art
[0006] The advancement of science and technologies has resulted in the widespread use of calculation processing apparatuses in various electronic products, such as personal computers, personal digital assistants (PDAs) or the like. A calculation processing apparatus generally comprises a lot of electronic components that generate heat during the operation, such as a central processing unit (CPU), a memory, or an integrated ...