Systems and methods for charging a cleaning solution used for cleaning integrated circuit substrates
a technology of cleaning solution and integrated circuit, applied in the field of systems and methods, can solve the problems of no mechanism to trap such detached particles, near zero dilution,
Inactive Publication Date: 2009-11-05
PURI SURAJ
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Benefits of technology
The method achieves effective cleaning without surface damage, reduces environmental impact, and increases throughput by using low concentrations of solute, eliminating the need for additional treatment and pretreatment steps, while maintaining high electrical performance.
Problems solved by technology
In the absence of such solute clusters, as is the case with conventional cleaning solutions, it is believed that there exists no mechanism to trap such detached particles, which subsequently land on and adhere to the substrate surface.
Use of “near zero dilutions” for cleaning substrates goes against conventional wisdom because conventional cleaning techniques require higher concentrations of the solute to facilitate particle removal through a reaction mechanism.
Method used
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Embodiment Construction
[0025]The present invention provides systems, methods and compositions for effectively cleaning integrated circuit (IC) substrates. Conventional wisdom dictates that for effectively cleaning IC substrates, high enough concentrations of the solute, which is typically an active cleaning ingredient in the cleaning solution, should be used. According to such wisdom, it is believed that high concentrations of the solute react with the substrate surface to detach contaminant particles therefrom. Predicated on this belief, conventional wisdom teaches away from using cleaning solutions with relatively low solute concentrations.
[0026]In the present invention, however, relatively low solute concentrations of the solute are preferred because they promote charging of a solution. It is believed that in a charged solution, solute particles, which are arranged as clusters, trap detached contaminant particle for effective removal from the substrate. As a result, the present invention focuses on for...
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Inventive methods, systems and compositions of cleaning integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substrate, to produce a charged solution, such that at least a portion of the solute is present as clusters in the charged solution; and conveying the charged solution for cleaning the IC substrate.The cleaning systems of the present invention include: a charging chamber for holding a solution, which contains at least a solute selected to promote cleaning of the integrated circuit substrate; and a first acoustic energy source capable of vibrating the solution in the charging chamber to produce a charged solution such that at least a portion of the solute is present as clusters in the charged solution.The cleaning compositions of the present invention include: a solvent; and a solute selected to promote cleaning of the IC substrate, wherein at least a portion of the solute is present in cluster form in the solution and the solute and solvent are present in a volumetric ratio that is between about 3×10−5:1 and about 1×10−24:1.
Description
FIELD OF THE INVENTION[0001]The present invention relates to systems and methods for effectively cleaning integrated circuit (“IC”) substrates. More particularly, the present invention relates to systems and methods for effectively charging a solution before it is used for cleaning IC substrates. In the charged solution, at least a portion of the solute particles are present in cluster form, as solute clusters. The present invention also provides compositions for effective cleaning of IC substrates.BACKGROUND OF THE INVENTION[0002]During the integrated circuit (“IC”) manufacturing process, contaminants, such as particles, photoresist residue and the like, are introduced on the IC substrate surface. It is important to eliminate or reduce the presence of these contaminants as they adversely impact the performance and function of the IC that is ultimately produced. Accordingly, various cleaning methods have been implemented to remove such undesirable contaminants.[0003]A cleaning metho...
Claims
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IPC IPC(8): B08B3/12
CPCH01L21/67057H01L21/02052H01L21/304
Inventor PURI, SURAJ
Owner PURI SURAJ