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Heat dissipation device

Inactive Publication Date: 2010-03-11
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the adhesive label is prone to accidental removal in whole or part, with such removal having the potential for unremoved adhesive to remain, contaminating the heat sink and environs.
In addition, the adhesive label is aesthetically unpleasing.

Method used

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Embodiment Construction

[0010]Referring to FIG. 1, a heat dissipation device in accordance with the disclosure is provided to dissipate heat generated by an electronic component (not shown) mounted on a printed circuit board (not shown). The heat dissipation device comprises a heat sink 10 thermally contacting the electronic component and a label member 20 securely disposed on the heat sink 10.

[0011]Also referring to FIG. 2, the heat sink 10 is integrally formed of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The heat sink 10 comprises a rectangular base 12 and a plurality of fins 14 extending upwardly from a top surface thereof. The fins 14 are spaced from each other and extend along a width of the base 12. Between each two adjacent fins 14 a passage (not labeled) therebetween allows airflow therethrough. The fins 14 comprise a plurality of first fins 141 divided into two parts located at opposite lateral sides of the base 12, respectively, and a plurality of second fins...

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Abstract

A heat dissipation device for an electronic component includes a heat sink thermally contacting the electronic component and a label member fixed on the heat sink for providing information. The heat sink includes a base and a plurality of fins extending upwardly from a top surface of the base. Two engaging portions protrude from two spaced fins, towards each other. Two flanges angle outwardly from two opposite lateral sides of the label member and clasp the two engaging portions of the heat sink, respectively.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present disclosure relates to heat dissipation, and, more particularly, to a heat dissipation device providing product information of the heat dissipation device.[0003]2. Description of Related Art[0004]Electronic components, such as central processing units (CPUs) comprise numerous circuits operating at high speed and generating substantial heat. Under most circumstances, it is necessary to cool the CPUs in order to maintain safe operating conditions and assure that the CPUs function properly and reliably. In the past, various approaches have been used to cool electronic components. Typically, a finned metal heat sink is attached to an outer surface of the CPU to remove the heat therefrom. The heat absorbed by the heat sink is then dissipated to ambient air. The related finned metal heat sink is made of highly heat-conductive metal, such as copper or aluminum, and generally comprises a base contacting the CPU to ab...

Claims

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Application Information

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IPC IPC(8): F28F13/00
CPCG06F1/20H01L23/3672H01L23/4093H01L2924/0002H01L2924/00H01L2223/54486H01L2223/54433
Inventor CHU, CHING-HUNGLI, CHANG-MU
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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