LED package and method for fabricating the same

a technology of light-emitting diodes and led packages, which is applied in the direction of semiconductor/solid-state device manufacturing, electrical equipment, semiconductor devices, etc., can solve the problems of cumbersome and complicated fabrication process of led packages, difficult to consecutively fabricate led packages, and conventionally difficult to design and fabricate led packages with variably changing viewing angles. , to achieve the effect of reducing the cost of led packages, and reducing the cost of led
US20110108866A1Inactive Publication Date: 2011-05-12SEOUL SEMICONDUCTOR
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
SEOUL SEMICONDUCTOR
Publication Date
2011-05-12
Estimated Expiration
Not applicable · inactive patent

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Abstract

An LED package is disclosed herein. The disclosed LED package comprises a base having an LED chip mounted thereon, an encapsulation member formed by a light-transmittable resin to encapsulate the LED chip, and a housing formed to expose a top portion of the encapsulation member and to encompass a side surface of the encapsulation member, wherein the encapsulation member is formed by a transfer molding process using a mold to have a predetermined shape. Further, the housing may be light-transmittable.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is the National Stage of International Application No. PCT / KR2008 / 007103, filed Dec. 2, 2008, and claims priority from and the benefit of Korean Patent Application No. 10-2007-0126436, filed on Dec. 6, 2007, which are both hereby incorporated by reference for all purposes as if fully set forth herein.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a light emitting diode (LED) package and a method of fabricating the same, and more particularly, to an improvement of an LED package, which includes a light-transmittable encapsulation member for encapsulating an LED chip and a housing configured to surround the encapsulation member.

[0004] 2. Discussion of the Background

[0005] An LED is a semiconductor light emitting device in which a current is supplied thereto and electrons and holes may be recombined in p-n semiconductor junctions to emit light. Conventionally, the LED is fabric...

Claims

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