Heat dissipating device and heat dissipating system
a heat dissipating device and heat dissipating system technology, applied in the direction of cooling/ventilation/heating modification, semiconductor/solid-state device details, semiconductor devices, etc., can solve the problems of resonance, noise, overheating, and high energy consumption, and achieve the effect of reducing the number of units
Inactive Publication Date: 2011-07-14
WISTRON CORP
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Problems solved by technology
However, high efficiency means high energy consumption and even causes drawbacks of resonance, noise, overheat and so on.
If heat generated by inner components of the electronic products can not be dissipated efficiently, it will affect operating stability and operating efficiency and even results in mechanical malfunction and damage.
It results in space limitation and high cost due to multilayer layout for overcoming the space limitation of disposing the electrical components.
On the other hand, if a single large heat dissipating device is utilized to dissipate heat generated by all processing chips simultaneously, it can overcome the above-mentioned problems of disposition of anchor structures or slots though, but since there is a height difference between the processing chips due to assembly tolerance, so as to cause poor contact between the single large heat dissipating device and the processing chips.
Thus, stepped finish of the contact surface or a thermal pad with high cost is required to overcome the poor contact problem.
Therefore, it is an important issue to design a favorable dissipating mechanism for dissipating heat generated by a plurality of heat sources simultaneously.
Method used
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[0029]Please refer to FIG. 1 to FIG. 4. FIG. 1 is an exploded diagram of a heat dissipating system 50 according to a first preferred embodiment of the present invention. FIG. 2 is an assembly diagram of the heat dissipating system 50 according to the first preferred embodiment of the present invention. FIG. 3 is a top view of the heat dissipating system 50 according to the first preferred embodiment of the present invention. FIG. 4 is a side view of the heat dissipating system 50 according to the first preferred embodiment of the present invention. The heat dissipating system 50 can be applied in a computer. The heat dissipating system 50 includes a circuit board 52, which can be a motherboard. The heat dissipating system 50 further includes a plurality of heat sources 54 installed on the circuit board 52 respectively, and the heat source 54 can be a processing chip and son on. The heat dissipating system 50 further includes a heat dissipating device 56 for dissipating heat generate...
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A heat dissipating device includes a supporting component installed on a circuit board. A plurality of openings is formed on the supporting component. The heat dissipating device further includes a plurality of heat dissipating components disposed on a side of the supporting component and installed inside the plurality of openings respectively for dissipating heat generated by a plurality of heat sources disposed on the other side of the supporting component. The heat dissipating device further includes a plurality of elastic components for pressing the plurality of heat dissipating components so that the plurality of heat dissipating components contacts the plurality of heat sources closely.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat dissipating device and a heat dissipating system, and more specifically, to a heat dissipating device for dissipating heat generated by a plurality of heat sources and a heat dissipating system.[0003]2. Description of the Prior Art[0004]With the improvement of technology, consumer electronic products have a great diversity of functions, thus the demand of efficiency is getting higher. However, high efficiency means high energy consumption and even causes drawbacks of resonance, noise, overheat and so on. For example, heat generated by executing all kinds of functions will increase with high operational efficiency. If heat generated by inner components of the electronic products can not be dissipated efficiently, it will affect operating stability and operating efficiency and even results in mechanical malfunction and damage. In current industry, a heat dissipating system is added ...
Claims
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CPCH01L23/4093H01L2924/0002H01L2924/00
Inventor LAI, JENG-MINGCHO, SHIH-HUAIHSIAO, WEI-CHUNGLIANG, CHUAN-YILIN, YI-JIUN
Owner WISTRON CORP