Carrier for manufacturing substrate and method of manufacturing substrate using the same

Abstract

Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing to the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

Description

CLAIM TO PRIORITY AND CROSS REFERENCE TO RELATED APPLICATION[0001]This application is a Divisional application of U.S. patent application Ser. No. 12 / 720,567 filed on Mar. 9, 2010, entitled “Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same”, and claims the benefit of Korean Patent Application No. 10-2009-0124708, filed Dec. 15, 2009, entitled “A carrier member for manufacturing a substrate and a method of manufacturing a substrate using the same”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a carrier for manufacturing a substrate and a method of manufacturing a substrate using the same.[0004]2. Description of the Related Art[0005]Generally, printed circuit boards (PCBs) are manufactured by patterning one or both sides of a substrate, composed of various thermosetting resins, using copper foil, and disposing and fixing I...

AI Technical Summary

Benefits of technology

The present invention provides a carrier for manufacturing a substrate, which can easily separate a build up layer by heating a metal layer having a relatively low melting point without performing a routing process. The carrier includes an insulation layer with a first metal layer, a second metal layer, and a third metal layer. The second metal layer has a lower melting point than the first metal layer, and the third metal layer has a higher melting point than the second metal layer. The method of manufacturing a substrate using this carrier involves heating the second metal layer to separate the build up layer from the carrier. The technical effects of this invention include improved efficiency and accuracy in the manufacturing process of substrates.

Problems solved by technology

However, since both edges of the carrier 10 are removed through a routing process during this separation procedure, the size of the carrier 10 is decreased, and thus it is difficult to reuse the carrier 10.

Therefore, the conventional substrate manufacturing method is problematic in that the carrier 10 must be additionally provided whenever a printed circuit board is manufactured, thus increasing the production cost of the printed circuit board.

Further, the conventional substrate manufacturing method is problematic in that it is difficult to maintain the compatibility between a substrate and a manufacturing facility because the size of the substrate is to changed by a routing process.

Furthermore, the conventional substrate manufacturing method is problematic in that the build up layer 15 can be arbitrarily separated from the carrier 10 because the build up layer 15 is actually fixed on the carrier 10 by only the adhesion force of the edge of the adhesive film 12.

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