Apparatus and method for enhanced heat transfer

Abstract

One embodiment of the system is implemented as a device for two-phase heat transfer. This device comprises a chamber containing a fluid, where a heated wall makes up a portion of the chamber. The device also comprises an actuator that emits pressure vibrations. The pressure vibrations dislodge vapor bubbles that form at the heated wall due to the heat in the wall.

Description

CLAIM TO PRIORITY[0001]This application is a continuation of and claims priority to U.S. patent application Ser. No. 11 / 205,665, now pending, which has the same title, and the same inventors, and is incorporated herein in its entirety; which application claims the benefit of the filing date of U.S. Provisional Patent Application Ser. No. 60 / 603,436, filed on Aug. 20, 2004, which is hereby incorporated by reference herein.BACKGROUND[0002]1. Technical Field[0003]The present invention is generally related to thermal management technology and, more particularly, is related to an apparatus and method for cooling heat-producing bodies or components using a two-phase cooling heat transfer device based on a vibration-induced bubble ejection process.[0004]2. Description of the Related Art[0005]Cooling of heat-producing bodies is a concern in many different technologies. Particularly in microprocessors, the rise in heat dissipation levels accompanied by a shrinking thermal budget has resulted...

AI Technical Summary

Benefits of technology

The present invention provides a system and method for cooling heated bodies and environments using a vibration-induced bubble injection system. The device uses small vapor bubbles attached to a solid surface and delays the onset of the critical heat flux, resulting in improved cooling performance compared to traditional methods. The device includes a chamber containing a fluid, a heated wall, and an actuator that emits pressure vibrations to dislodge the vapor bubbles from the heated wall. The method involves generating heat in the wall, causing the formation of vapor bubbles, and emitting pressure vibrations into the fluid, wherein the vapor bubbles dislodge from the heated wall due to the pressure vibrations. The invention has various applications, such as cooling electronic devices and improving cooling efficiency in power generation systems.

Problems solved by technology

Thermal management is recognized as a major challenge in the design and packaging of state-of-the-art integrated circuits in single-chip and multi-chip modules.

First, the liquid to vapor phase change greatly increases the heat flux from the heated surface.

There are limitations to the current state of the art in two-phase cooling.

First, two-phase heat transfer systems have traditionally been viewed as incompatible with microelectronic packages.

When the heat flux from the surface is increased past a critical level, a large, potentially catastrophic increase in temperature occurs.

In film boiling, a thin insulating layer of vapor completely covers the heated surface, which then produces a large temperature increase.

Thus, the performance of immersion cooling in this environment is drastically reduced.

A heretofore unaddressed need exists in the industry to address the aforementioned deficiencies and inadequacies.

The VIBE device described below exceeds the performance of conventional immersion cooling devices because it delays the onset of the critical heat flux.

Images