Heat exchanger structure with flow divider
a technology of heat exchanger and flow divider, which is applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of low efficiency of electronic elements, waste heat produced by electronic elements, damage, etc., and achieve the effect of increasing the operating power of the pump and reducing the pressure drop
Inactive Publication Date: 2012-06-21
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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Benefits of technology
The present invention provides a heat exchanger structure with a flow divider that reduces the pressure drop of a cooling liquid that changes flow direction at a turn in the heat exchanger. This structure does not require an increase in the operating power of a pump for delivering the cooling liquid. The cooling liquid is divided by the flow divider into two parts to separately flow through the first and the second sub-passage, resulting in only a reduced pressure drop and improved cooling efficiency.
Problems solved by technology
However, when these electronic apparatus operate at high speed, electronic elements thereof will produce waste heat.
The produced heat must be timely expelled from the electronic apparatus, lest the heat should accumulate in the electronic apparatus to constantly increase the temperature thereof and cause overheating, damage, failure, or low efficiency of the electronic elements.
However, the cooling fan can only produce very limited air flow and accordingly fails to enable largely lowered temperature and upgraded heat dissipation effect.
However, while the flow passage with turns indeed allows the cooling liquid to stay in the water-cooling type heat dissipation device longer, the turns also change the flow direction of the cooling liquid to adversely affect the flowing of the cooling liquid and result in pressure drop of the cooling liquid.
Therefore, the conventional water-cooling type heat dissipation device has the following disadvantages: (1) the cooling liquid is subject to the problem of pressure drop; and (2) it is necessary to increase the operating power of the pump to overcome the problem of pressure drop.
Method used
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[0021]The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
[0022]Please refer to FIGS. 1 and 2 that are exploded and assembled perspective views, respectively, of a heat exchanger structure with flow divider according to a first preferred embodiment of the present invention; and to FIG. 3 that is assembled sectional view of FIG. 1. For the purpose of conciseness, the present invention is also briefly referred to as “the heat exchanger structure” herein. As shown, the heat exchanger structure in the first embodiment is generally denoted by reference numeral 10, and includes a cover 20 and a heat-conductive main body 30. The cover 20 is assembled to an open top of the main body 30 to close the latter, so as to define a flow passage 31 in the heat exchanger structure 10. ...
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A heat exchanger structure with flow divider includes a heat-conductive main body provided with a flow passage having at least one inner turn and one outer turn, and at least one flow divider located near and downstream the inner turn, such that a cooling liquid in the flow passage flowing through the inner and the outer turn to reach at the flow divider is divided by the flow divider into two smaller flows. Therefore, the cooling liquid in the flow passage has reduced pressure drop and it is not necessary to increase the operating power of a pump that delivers the cooling liquid into the flow passage.
Description
FIELD OF THE INVENTION[0001]The present invention relates to a heat exchanger structure, and more particularly to a heat exchanger with flow divider that effectively reduces the pressure drop of a cooling liquid that changes its flow direction at a turn in the heat exchanger, so that a pump for delivering the cooling liquid into the heat exchanger does not need to increase the operating power thereof.BACKGROUND OF THE INVENTION[0002]Following the increasing progress in the electronic information technology, various kinds of electronic apparatus, such as computers, notebook computers, communication chassis and the like, are now highly popular and have very wider applications. However, when these electronic apparatus operate at high speed, electronic elements thereof will produce waste heat. The produced heat must be timely expelled from the electronic apparatus, lest the heat should accumulate in the electronic apparatus to constantly increase the temperature thereof and cause overhe...
Claims
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IPC IPC(8): F28F27/02
CPCF28F3/048F28D15/00H01L23/473F28D2021/0028H01L2924/0002H01L2924/00
Inventor KAO, PAI-LINGLEE, SUNG-WEIZHONG, FU-MING
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD