Heat dissipation device and method of manufacturing same
a heat dissipation device and heat dissipation technology, which is applied in the direction of metal-working devices, semiconductor devices, tubular elements, etc., can solve the problems of complicated and high-cost assembly of heat dissipation devices
Inactive Publication Date: 2012-06-21
FU ZHUN PRECISION IND SHENZHEN +1
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
[0004]Heat dissipation devices are used to remove heat from heat-generating electronic components such as central processing units (CPUs) and others, keeping the electronic components within safe working temperature limits, and enabling stable operation. A typical heat dissipation device includes a base contacting an electronic component and absorbing heat therefrom, a number of fins, and a heat pipe. The heat pipe has one end connected to the base by solder and the other end connected to the fins. The fins dissipate the heat to the ambient environment.
Problems solved by technology
Such process materials and manufacturing procedures render assembly of the heat dissipation device somewhat costly and complicated.
Method used
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[0014]Reference will now be made to the figures to describe the present heat dissipation device and method in detail.
[0015]Referring to FIGS. 1 and 2, a heat dissipation device according to an exemplary embodiment of the present disclosure includes a first fin unit 10, a second fin unit 20, a third fin unit 30, three heat pipes 40, a first base 50 and a second base 60. In alternative embodiments, the number of heat pipes 40 can vary according to particular requirements.
[0016]Referring also to FIGS. 3-5, the first fin unit 10 includes a plurality of first fins 11 stacked together. Each of the first fins 11 is almost rectangular, and includes a rectangular main body 110, an extending portion 112 extending upward from a middle portion of a top side of the main body 110, a first flange 1104 extending perpendicularly from a bottom side of the main body 110, and a pair of second flanges 1106 extending perpendicularly from end portions of the top side of the main body 110 (i.e., portions o...
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Abstract
An exemplary heat dissipation device includes a first fin unit, a second fin unit, a heat pipe, a first base and a second base. The heat pipe includes a condensing section extended through the first fin unit and the second fin unit and an evaporating section extending from the condensing section. The evaporating section includes a first heat absorbing portion extended through the first fin unit and a second heat absorbing portion spaced from the second fin unit. The first base is located at one side of the second fin unit and supports the second heat absorbing portion thereon. The second base is covered on the first base. The first and second bases sandwich the second heat absorbing portion therebetween.
Description
BACKGROUND[0001]1. Technical Field[0002]The disclosure generally relates to device cooling, and more particularly to a heat dissipation device and a method of manufacturing the heat dissipation device.[0003]2. Description of the Related Art[0004]Heat dissipation devices are used to remove heat from heat-generating electronic components such as central processing units (CPUs) and others, keeping the electronic components within safe working temperature limits, and enabling stable operation. A typical heat dissipation device includes a base contacting an electronic component and absorbing heat therefrom, a number of fins, and a heat pipe. The heat pipe has one end connected to the base by solder and the other end connected to the fins. The fins dissipate the heat to the ambient environment.[0005]When the heat dissipation device is manufactured, soldering flux must be added between the heat pipe and the base for soldering the heat pipe and the base together. Furthermore, since the heat...
Claims
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Patent Timeline
Login to View More IPC IPC(8): F28D15/04B21D53/02
CPCH01L23/427H01L2924/0002Y10T29/49378H01L2924/00F28D15/0275F28F1/32
Inventor LIU, JIANZHANG, JING
Owner FU ZHUN PRECISION IND SHENZHEN