Stacked semiconductor chips packaging

Abstract

Various methods and apparatus for joining stacked substrates to a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes coupling plural substrates to form a stack. At least one of the plural substrates is a semiconductor chip. Plural conductive vias are formed in a first of the plural substrates. Each of the plural conductive vias includes a first end positioned in the first substrate and a second end projecting out of the first substrate.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]This invention relates generally to semiconductor processing, and more particularly to methods and apparatus for stacking multiple semiconductor devices and packaging the same.[0003]2. Description of the Related Art[0004]Some time ago semiconductor chip designers began stacking multiple semiconductor dice (aka “dies”) vertically in order to obtain more functionality without an attendant increase in required package substrate or circuit board area. A variety of techniques have been used to electrically connect adjacent dice in such stacked arrangements. One technique has involved the use of wire bonds leading from contact pads on one die to corresponding contact pads on an adjacent die. Another technique that has been introduced more recently involves the use of so-called thru-silicon-vias (TSV). A typical TSV is a conductive via that extends nearly or perhaps entirely through a semiconductor chip, depending on the prese...

AI Technical Summary

Benefits of technology

The present invention provides a method of manufacturing a stack of substrates that includes a semiconductor chip. The method includes forming conductive vias in the chip and coupling them to corresponding conductor pads on a circuit board. The conductive vias have a first end in the chip and a second end that projects out of the chip. The technical effect of this invention is to provide a reliable and efficient way to connect semiconductor chips to other components in a circuit board, which can improve performance and reliability of the overall circuit.

Problems solved by technology

A technical challenge associated with most mounting schemes is the establishment of electrical interfaces between the semiconductor die or dice and the receiving circuit board.

The fabrication of these electoral interfaces may be particularly challenging in a stacked dice arrangement.

Expenses in the form of material and labor costs are associated with the conventional copper pillar process.

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