Computer and electronic cabinet cooling chamber
a technology for electronic cabinets and cooling chambers, applied in the field of systems for, can solve the problems of circuit board and electronic chips during operation, severe heat generation problems, and the entire system to malfunction or shut down, and the problem has become even more acu
Inactive Publication Date: 2012-10-04
LIVINGSTON TROY W
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- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
As is well known in the electronics industry, that the heat created by circuit boards and electronic chips during operation is a serious problem.
Heat build-up may cause a circuit board or electronic chip to malfunction and cause the entire system to also malfunction or to shut down.
The problem has become even more acute due to the fact that circuit boards have become smaller and / or more highly populated with components thus causing the source of heat to become more intense.
These latter systems are voluminous and heavy.
Method used
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[0017]FIG. 1 is an isometric view of printed circuit board 14, with discrete components 15 and IC chips 12, all being of well known types, to show the environment in which the present invention is utilized.
[0018]FIG. 2 depicts one embodiment of inventive system 10 comprising a fluid cooling chamber 11 for integrated circuit (IC) chips 12 and discrete components 15 mounted on an electronic circuit board indicated at 14. FIG. 3 is an isometric view of the inventive system 10 and FIG. 4 is a top view of the chamber 11 which in combination with FIG. 1 clearly show the structure of the chamber 11.
[0019]FIG. 2 is a front cut-a-way section which depicts the internal structure of the chamber 11. Chamber 11 is enclosed in a metal housing 24 and spaced metal fins 25 to provide cooling additional structure are affixed around the housing. Chamber 11 is sealably mounted on printed circuit board (PC) 14. A number of electrical conductive pins 16 extend from chips and from electronic components 15...
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A cooling chamber for computers and for electronic components includes a conductive chamber containing a low boiling point fluid. The components are mounted in the chamber to be bathed by the fluid. The heat energy developed by the components causes the fluid to reach a temperature above the boiling point thus forming bubbles. Bubble guide tubes guide the bubbles upwardly, and fluid confined in the tubes between the bubbles is moved (pushed) upwardly. The cumulative action of the bubbles will cause circulation of the fluid in the chamber thus circulating fluid flow around the electronic components and flow around the chamber. Cooling fins mounted on the exterior of the chamber dissipate the heat generated by the components.
Description
[0001]This application claims the benefit of the earlier filing date of the provisional application Ser. No. 61 / 516,212, filed on Mar. 31, 2011 of the same title and of the same inventor, Troy W. Livingston.BACKGROUND OF INVENTION[0002]The present invention relates to system for removing heat from heat generating components, and more particularly to a method and system for removing heat from electronic circuit boards and electronic chips.[0003]As is well known in the electronics industry, that the heat created by circuit boards and electronic chips during operation is a serious problem. Heat build-up may cause a circuit board or electronic chip to malfunction and cause the entire system to also malfunction or to shut down. The problem has become even more acute due to the fact that circuit boards have become smaller and / or more highly populated with components thus causing the source of heat to become more intense. Accordingly, the heat build-up in circuit boards and IC chips must b...
Claims
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Patent Timeline
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CPCF28D15/0233H01L23/367H01L23/44G06F1/20H01L2924/0002G06F2200/201H01L2924/00F28D15/0266
Inventor LIVINGSTON, TROY W.
Owner LIVINGSTON TROY W