Printed circuit board
a printed circuit board and printed circuit technology, applied in the field of printed circuit boards, can solve the problems of voids or dimples occurring during the filling process of insulating resin, increased manufacturing costs, and reduced adhesion, so as to achieve simple manufacturing procedures and high circuit pattern reliability
Inactive Publication Date: 2012-10-11
SAMSUNG ELECTRO MECHANICS CO LTD
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AI Technical Summary
Benefits of technology
This approach simplifies the manufacturing process, enhances the reliability of circuit patterns, via lands, and vias, prevents voids and dimples, and improves electrical connections while enabling efficient heat release through conductive vias, resulting in a more reliable and cost-effective printed circuit board.
Problems solved by technology
As such, a method of manufacturing a printed circuit board according to the related art may require numerous processes, such as mechanical drilling, plating the via holes, filling with an insulating resin, and applying cap plating, resulting in a complicated manufacturing procedure and increased costs.
Moreover, in a printed circuit board manufactured according to the related art, the adhesion may be degraded at the interface between the insulating resin filled in the vias and the cap plating, and there is a risk of voids or dimples occurring during the process of filling the insulating resin.
Method used
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[0020]As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to particular modes of practice, and it is to be appreciated that all changes, equivalents, and substitutes that do not depart from the spirit and technical scope of the present invention are encompassed in the present invention. In the description of the present invention, certain detailed explanations of related art are omitted when it is deemed that they may unnecessarily obscure the essence of the invention.
[0021]While such terms as “first,”“second,” etc., may be used to describe various elements, such elements must not be limited to the above terms. The above terms are used only to distinguish one element from another.
[0022]The terms used in the present specification are merely used to describe particular embodiments, and are not inte...
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A printed circuit board including: a first insulation layer; a second insulation layer stacked over the first insulation layer; a circuit pattern and a via land buried in the second insulation layer; and a via penetrating the first insulation layer and integrated with the via land, the via made of a conductive material.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a U.S. divisional application filed under 37 CFR 1.53(b) claiming priority benefit of U.S. Ser. No. 12 / 230,101 filed in the United States on Aug. 22, 2008, which claims earlier priority benefit to Korean Patent Application No. 10-2008-0014405 filed with the Korean Intellectual Property Office on Feb. 18, 2008, the disclosures of which are incorporated herein by reference.BACKGROUND[0002]1. Field[0003]The present invention relates to a printed circuit board and to a method of manufacturing the printed circuit board.[0004]2. Description of the Related Art[0005]In the related art, a method of manufacturing a printed circuit board that has conductive vias between layers and circuit patterns on the outer layers may include forming circuit patterns over a core substrate and forming vias that penetrate the core substrate, and then forming stack-vias.[0006]According to the related art, via holes may be formed by drilling throu...
Claims
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IPC IPC(8): H05K1/02
CPCH05K3/0023H05K3/045H05K3/107H05K3/423Y10T29/49126H05K2201/0376H05K2201/09563H05K2203/0353Y10T29/49165H05K3/426H05K1/02H05K1/09
InventorSHIN, HEE-BUMMOON, JEONG-HOEOM, JAE-HYUNMOK, JEE-SOO
OwnerSAMSUNG ELECTRO MECHANICS CO LTD