Composite thermoformed assembly

Abstract

Methods for producing cost effective and reliable antennas and circuits for wireless devices are disclosed. The antennas and circuits are formed by applying a conductive layer to one side of a carrier sheet and attaching a second carrier sheet to encapsulate and protect the conductive layer. The combination of the two carrier sheets and the conductive layer are then formed into one or more three-dimensional antenna structures or circuits in a thermoforming process. This technique enables high volume production of antennas and RF circuits in a fast, reliable, and cost-efficient manner that provides for encapsulation of the conductive layer. The plurality of antennas and circuits formed in this fashion may then be separated by a cutting apparatus to obtain individual devices that are ready for integration into myriad communication devices.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation-in-part of U.S. patent application Ser. No. 12 / 337,639, filed Dec. 18, 2008, which claims priority to Provisional Ser. No. 61 / 037,278, filed Mar. 17, 2008, and further claims priority to Provisional Ser. No. 61 / 496,878, filed Jun. 14, 2011; the contents of each of which are hereby incorporated by reference.FIELD OF INVENTION[0002]This invention relates generally to the field of wireless communications. In particular, the invention relates to antennas, circuits, and methods for forming antennas and circuits for use in wireless communications.BACKGROUND OF THE INVENTION[0003]With the proliferation of wireless products and services, device manufacturers are forced to aggressively pursue cost reduction opportunities in the manufacturing and assembly of wireless device components. Reduction of costs associated with wireless antennas and electronic assemblies may thus be an important factor in staying competit...

AI Technical Summary

Benefits of technology

The present invention provides methods for making cost-effective and reliable wireless antennas and feed networks. The methods involve using non-conductive carrier sheets with conductive layers and / or multiple conductive layers separated by non-conductive layers. The antennas or circuits can be formed by thermoforming the combined carrier sheets and conductive layer. The resulting antennas have reliable connections to electronic assemblies or transceivers through conductive engagement or capacitive coupling. The invention also provides methods for making antennas on a tape-on-reel package and for incorporating protrusions for connecting to circuit boards. The technical effects of the invention include improved reliability and efficiency of wireless antennas and feed networks.

Problems solved by technology

Each of these techniques suffers from high cost of production.

The stamped metal element and the plastic carrier each require expensive and time consuming tooling for high volume production.

Furthermore, while the flex-circuit antenna may be readily fabricated using a standard etching process, this technique is typically a more expensive solution compared to a stamped metal element.

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