Small Form-Factor Pluggable Optical Transceiver

Abstract

A small form-factor pluggable (SFP) optical transceiver includes a casing configured to accommodate optical and electrical devices. During normal operation, the casing is connected to a switchboard via a connector in the switchboard, and the optical devices are outside the switchboard, thereby exposing optical devices sensitive to high temperature to the outside air, reducing the operational temperature of the optical device portion relative to the heated portion inside the switchboard. Thus, the present SFP optical transceiver advantageously improves operational performance and extends the life of the device. Also, the present SFP optical transceiver having the optical device portion outside the switchboard advantageously improves the cooling performance for the optical device portion.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Chinese Patent Application No. 201210471478.3, filed on Nov. 20, 2012, which is incorporated herein by reference as if fully set forth herein.FIELD OF THE INVENTION[0002]The present invention generally relates to the field of optoelectronic communications and devices therefor, and particularly to an optical transceiver. More specifically, embodiments of the present invention pertain to a small form-factor pluggable (SFP) optical transceiver, particularly circuits, devices, and method(s) of making and / or using the same.DISCUSSION OF THE BACKGROUND[0003]A small form-factor pluggable (SFP) optical transceiver, generally defined by an applicable MSA standard, provides bidirectional data transmission in optical communications. Generally, a conventional SFP optical transceiver comprises (i) a casing, (ii) electrical devices, such as printed circuit boards (PCB), chips, etc., and (iii) optical devices, such ...

AI Technical Summary

Benefits of technology

The present invention is a two-cavity SFP optical transceiver module that can operate at two different temperatures in different regions of the module. The module has an extended nose with two operating temperature zones, which allows for better performance, lower operational costs, and improved yields. The optical portion of the module should stay at a temperature ≦85° C. to reduce the impact of thermal issues on operational performance and extend the life of the device. The invention also minimizes the transfer of heat from the electrical portion of the module to the optical devices, which helps reduce operating temperatures and improves operational performance. The air holes in the casing and the positioning of the air holes facilitate the exchange of heat outside the device with the air inside the device. The isolator between the two cavities is designed to minimize the transfer of heat during normal operation, reducing the impact of high temperatures on the optical devices. Overall, the invention improves the cooling and performance of the optical devices in a cost-effective and efficient manner.

Problems solved by technology

However, overheating of the optical device cannot be eliminated.

Generally, overheating of the optical device occurs after connecting the SFP optical transceiver to the switchboard, since the electrical and optical devices of the SFP optical transceiver are completely enclosed in the switchboard.

The switchboard and the electrical devices of the SFP optical transceiver emit a significant amount of heat during normal operation, creating a relatively hot environment within the device, thereby resulting in relatively low efficiency and a decrease in the life of the device.

As optical and electrical devices are placed in one cavity in the conventional SFP optical transceiver, high heat close to the electrical device could easily transfer to the optical device, negatively affecting the performance and the life of the optical device,

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