40results about How to "Increase port density" patented technology

A communication patching system includes a platform configured to support a plurality of cables and a first panel pivotably mounted to the platform, the first panel having at least one holder for securing communications adapters to the first panel. A first set of communications adapters is connected to the platform, and a second set of communications adapters mounted in the at least one holder. The first panel is pivotable between a first position in which the second set of communications adapters is spaced from the first set of communications adapters by a first distance and a second position in which the second set of communications adapters is spaced from the first set of communications adapters by a second distance greater than the first distance.

Systems and methods are provided for reducing power consumption of a multi-die device, such as a network processor FPGA (npFPGA). The multi-die device may include hardware resources such as FPGA dies, which may be coupled to NIC dies and / or memory dies. Power consumption of the multi-die device may be reduced by monitoring usage of hardware resources in the multi-die device, identifying hardware resources that are not in use, and gating power to the identified hardware resources. The status of processing elements (PEs) in the multi-die device may be tracked in a PE state table. Based on the PE state table, tasks from a task queue may be assigned to one or more processing elements.

A communication patching system includes a platform configured to support a plurality of cables and a first panel pivotably mounted to the platform, the first panel having at least one holder for securing communications adapters to the first panel. A first set of communications adapters is connected to the platform, and a second set of communications adapters mounted in the at least one holder. The first panel is pivotable between a first position in which the second set of communications adapters is spaced from the first set of communications adapters by a first distance and a second position in which the second set of communications adapters is spaced from the first set of communications adapters by a second distance greater than the first distance.

Disclosed are a method and a system for remote wake-up and status check, with a wake-up signal generating unit generating and transmitting a wake-up signal to wake up an electricity supply unit of a remote device to operate normally and provide electricity for the remote device. The wake-up signal has an assigned electric voltage with specific characteristics for detection by the electricity supply unit while in power-off mode and, upon signal detection, the electricity supply unit wakes up to provide normal electric voltage output. The wake-up signal generating unit determines, according to an electric current on a wake-up signal feed line, whether the remote device is in an active mode. A low wake-up energy consumption enables system wake-up and a true powered-off sleep mode.

A telecommunications patching system includes: a carrier having a generally vertically disposed carrier panel, the carrier panel including a cutout area; and a plurality of patching modules. Each of the patching modules has a main panel and a plurality of telecommunications connectors mounted thereon. The patching modules are inserted into the cutout area so that the main panels thereof are substantially parallel to each other, and so that the main panels define an oblique angle relative to vertical. In such a configuration port density can be increased over typical systems.

A method and apparatus for characterizing and compensating optical impairments in an optical transmitter includes operating an optical transmitter comprising a first and second parent MZ, each comprising a plurality of child MZ modulators that are biased at respective initial operating points. An electro-optic RF transfer function is generated for each of the plurality of child MZ modulators. Curve fitting parameters are determined for each of the plurality of electro-optic RF transfer functions and operating points of each child MZ modulator are determined using the curve fitting parameters. An IQ power imbalance is determined using the curve fitting parameters. Initial RF drive power levels are determined that compensate for the determined IQ power imbalance. The XY power imbalance is determined for initial RF drive power levels using the curve fitting parameters. The operating RF drive powers are determined that at least partially compensate for the first and second IQ power imbalances and for the XY power imbalance for the optical transmitter.

The disclosed VoIP gateway comprises: based on prior art, adding a time-slot exchange chip and DSP, and using a microprocessor to distinguish local and IP dialogue. This invention reduces time delay and cost, and improves voice quality.

An optical apparatus can include an optical port array having an M×N array of fiber collimator ports. The array of ports is configured such that there is a gap within each column of ports located between two rows of ports. The gap is wide enough to permit a hitless beam switching trajectory to pass between the two rows of ports from one side of the array of ports to an opposite side.

A method and apparatus for characterizing and compensating optical impairments in an optical transmitter includes operating an optical transmitter comprising a first and second parent MZ, each comprising a plurality of child MZ modulators that are biased at respective initial operating points. An electro-optic RF transfer function is generated for each of the plurality of child MZ modulators. Curve fitting parameters are determined for each of the plurality of electro-optic RF transfer functions and operating points of each child MZ modulator are determined using the curve fitting parameters. An IQ power imbalance is determined using the curve fitting parameters. Initial RF drive power levels are determined that compensate for the determined IQ power imbalance. The XY power imbalance is determined for initial RF drive power levels using the curve fitting parameters. The operating RF drive powers are determined that at least partially compensate for the first and second IQ power imbalances and for the XY power imbalance for the optical transmitter.

Systems and methods are provided for reducing power consumption of a multi-die device, such as a network processor FPGA (npFPGA). The multi-die device may include hardware resources such as FPGA dies, which may be coupled to NIC dies and / or memory dies. Power consumption of the multi-die device may be reduced by monitoring usage of hardware resources in the multi-die device, identifying hardware resources that are not in use, and gating power to the identified hardware resources. The status of processing elements (PEs) in the multi-die device may be tracked in a PE state table. Based on the PE state table, tasks from a task queue may be assigned to one or more processing elements.

Methods of automatically tracking a patching connection between a first connector port of a patch panel and a second connector port of a network device are provided in which a sensor is used to detect that a first end of a patch cord has been inserted into the second connector port. The patch cord has at least one data communications channel and a separate control channel. A first conductor of the control channel of the patch cord is biased to power an integrated circuit chip on the network device. In response to the detection by the sensor, a first signal is transmitted over the separate control channel of the patch cord to the network device. A second signal is received over the control channel of the patch cord in response to the first signal. The second signal includes a unique identifier that is associated with the second connector port.

A method and apparatus for characterizing and compensating optical impairments in an optical transmitter includes operating an optical transmitter comprising a first and second parent MZ, each comprising a plurality of child MZ modulators that are biased at respective initial operating points. An electro-optic RF transfer function is generated for each of the plurality of child MZ modulators. Curve fitting parameters are determined for each of the plurality of electro-optic RF transfer functions and operating points of each child MZ modulator are determined using the curve fitting parameters. An IQ power imbalance is determined using the curve fitting parameters. Initial RF drive power levels are determined that compensate for the determined IQ power imbalance. The XY power imbalance is determined for initial RF drive power levels using the curve fitting parameters. The operating RF drive powers are determined that at least partially compensate for the first and second IQ power imbalances and for the XY power imbalance for the optical transmitter. An optical signal comprising a Nyquist-pulse-shape is generated at an output of the optical transmitter.

A broadband subscriber access equipment user board includes motherboard interface module, uplink and downlink channel connected with motherboard interface module, wherein downlink channel including digital modulation demodulation device, modulating filter circuit, electric light conversion module, uplink channel including photoelectric conversion module, demodulation filter circuit, digital modulation demodulation device. The present invention also provides broadband subscriber access equipment using above-mentioned user board and method.

Multiple network switches are configured having memory interfaces that transfer segmented frame data to each other via a data path having multiple rings connecting the network switches. The memory interfaces are also configured for transferring the segmented frame data to respective local buffer memories for temporary storage. The data path transfers the data units between the switches according to a prescribed sequence protocol, optimizing memory bandwidth by requiring only one read and one write operation to and from a local buffer memory for each segmented frame data being received and transmitted through the switches.

The invention discloses a multi-line card high-density TAP switch based on FPGAs. The multi-line card high-density TAP switch comprises a plurality of line card modules, a high-speed serial backboard,a master control module and a switch module. The line card modules receive data streams of network side interfaces, identify protocol information of the data streams, send the data streams of the network side interfaces to the switch module, receive the data streams sent by the switch module, and send the processed data streams and the data streams uploaded by the switch module to tool side interfaces. The switch module realizes data and control information switch among the line card modules, and between the line card modules and the master control module, identifies and processes the received data streams of the network side interfaces, and sends the processed data streams to the line card modules according to a TAP switch policy customized by a user. The master control module realizes control and state monitoring of a complete machine, issues control and configuration instructions to the line card modules through the switch module, and collects state information of the line card modules and the switch module.

A gap services router (GSR) that is a drop-in replacement of an end of life Cisco™ 2811 integrated services router (ISR). The GSR is a routing, switching, and computing platform that provides a technology refresh in the same form factor as the legacy 2811 router. The GSR is one rack unit in size and comprises the latest routing and switching technology from Cisco™, preferably a Cisco™ 5915 embedded services router (ESR) and a Cisco™ embedded services 2020 switch. The GSR contains two WAN ports and twenty-five LAN ports, with power over ethernet capability on all ports. The GSR also optionally includes an embedded server module capable of running the latest virtualization technology. An embedded server module in the GSR includes a removable solid state drive (SSD) that is zeroed upon removal. The GSR is preferably used to replace 2811 ISRs integrated in deployed military equipment.

The embodiment of the invention provides an optical line terminal, which is connected between a local side and an optical network unit, and comprises an optical drive circuit and an optical transceiver module. The optical transceiver module comprises an optical transmitting assembly and a wavelength division multiplexing assembly. The optical drive circuit performs first signal processing on downlink data provided by the local side to obtain an optical drive signal; the light driving signal drives the light emitting assembly to obtain a first downlink light signal and a second downlink light signal with different wavelengths; the wavelength division multiplexing assembly performs optical coupling on the first downlink optical signal and the second downlink optical signal; and provides the coupled downlink optical signal to the optical network unit.

The invention provides communication equipment, a pluggable optical module, a communication system, a method and a storage medium, and belongs to the technical field of communication. The communication device comprises a control module and an address management module. The control module is used for reporting an insertion event to the address management module when the insertion event of the pluggable optical module is detected, and an appointed pin is arranged on the pluggable optical module; And the address management module is used for selecting first address information from the address database when an insertion event is received, setting an appointed pin of the pluggable optical module as a first level, enabling the pluggable optical module to be in an address allocation mode, and allocating the first address information to the pluggable optical module. Address information distributed by different pluggable optical modules can be ensured not to be repeated, the limitation of thenumber of address pins is avoided, only one designated pin needs to be arranged on the pluggable optical module, the number of pins can be reduced, the packaging size of the pluggable optical module is reduced, and then the port density of communication equipment is improved.

A connector system includes a main board and an interposer board. The main board and the interposer board are each configured to mate to a separate connector and are connected together by vias. The vias can provide an electrical path from the interposer board to the main circuit board so that a first connector mounted on the interposer board can be positioned directly in line with a second connector mounted on the main circuit board. The interposer helps make the routing out of signal traces from the two connector simpler while reducing the need for additional layers on the main board. Two connectors can be press-fit mounted to the main board and the interposer board in a belly-to-belly configuration.

An electro-optical modulator includes a substrate comprising a first Mach-Zehnder modulator comprising a first waveguide and a second waveguide and a second Mach-Zehnder modulator comprising a first waveguide and a second waveguide. A first positive signal electrode is positioned on the substrate over the first waveguide of the first Mach-Zehnder modulator and a first negative signal electrode is positioned on the substrate over the second waveguide of the first Mach-Zehnder modulator. The first positive signal electrode and the first negative signal electrode are connected to a first differential signal input. A second positive signal electrode is positioned on the substrate over the first waveguide of the second Mach-Zehnder modulator and a second negative signal electrode positioned on the substrate over the second waveguide of the second Mach-Zehnder modulator. The second positive signal electrode and the second negative signal electrode are connected to a second differential signal input. A first ground electrode is positioned on the substrate between the first and second Mach-Zehnder modulators connected to ground potential. A second ground electrode is connected to ground potential and positioned on the substrate adjacent to the first Mach-Zehnder modulator such that the first positive signal electrode and the first negative signal electrode are between the second ground electrode and the first ground electrode. A third ground electrode is connected to ground potential and positioned on the substrate adjacent to the second Mach-Zehnder modulator such that the second positive signal electrode and the second negative signal electrode are between the third ground electrode and the first ground electrode. A plurality of first electrical connectors connect the first ground electrode to the second ground electrode and a plurality of second electrical connectors connect the first ground electrode to the third ground electrode. A spacing between at least two of the plurality of first electrical connectors is chosen to achieve a desired cross talk between an optical signal generated by the first Mach-Zehnder modulator and an optical signal generated by the second Mach-Zehnder modulator.

The invention discloses a method for manufacturing a high-speed broadband silicon light adapter plate, and a silicon-based optical interconnection device. A photonic device and a TSV are communicated through first and second RDLs; a first electron device and a second electron device are respectively connected with the photonic device through a first salient point and a second salient point; a third RDL and a third back salient point are connected with a substrate through the TSV, so that the communication between the substrate and a front CMOS (Complementary Metal Oxide Semiconductor) / photonic device is realized. In the invention, an advanced CMOS chip and multiple monolithic silicon optical devices are mixed and integrated. Meanwhile, the monolithic integration of the high-performance silicon photonic devices on an SOI (Silicon on Insulator) substrate and the advanced manufacture of the CMOS chips are guaranteed, the high-performance silicon photonic devices and the CMOS chips can be manufactured by adopting various advanced and convenient processes, and the cost can be greatly reduced by fully utilizing a CMOS process. Moreover, the ultra-short-distance high-speed electrical interconnection between each silicon photonic device in the monolithic integration and each advanced CMOS chip is realized by adopting a TSV technology, and the high-speed broadband silicon light interconnection is realized.

An increased connector port density assembly is disclosed for providing more connector ports than would normally fit on a faceplate. The increased connector port density assembly includes a stationary board and an extendable board connected to the stationary board on rails and with cabling. The extendable board has a first and second set of forward facing connector assemblies. The first set accessible when the extendable board is in either the retracted or extended position, whereas the second set of connector assemblies is accessible when the extendable board is in the extended position. The increased connector port density assembly is particularly useful for overcoming faceplate connector area availability limitations known in the art.

The invention discloses a manufacturing method applied to a high-speed broadband optical interconnection TSV device and the silicon-based optical interconnection device. According to the method and the silicon-based optical interconnection device, firstly, a wide ring is etched to be filled with insulating material, then, silicon surrounded by the insulating ring is etched to form deep TSVs, and finally, the deep TSVs are filled with metal to be connected with the electrodes of front face photonic devices. Due to formation of the wide ring, the thickness of an insulating layer is increased, meanwhile, filling of the insulating material is facilitated, and therefore the TSV parasitic capacitance is greatly reduced, and transmission of high-speed broadband signals is facilitated; meanwhile, the TSVs are formed after the wide ring is filled with the insulating material, many technological problems caused by the situation that in a traditional technology, the insulating material at the bottoms of the TSVs is first selectively etched when the TSVs are metallized are avoided, and the silicon-based optical interconnection device can be connected to the electrodes of the wafer front face photonic devices from the back face more easily. According to the method and the silicon-based optical interconnection device, CMOS devices are integrated on the back face, the Si photonic devices are integrated on the front face, higher freedom degree can be provided for photonic monolithic integration design, and it is also guaranteed that more light source coupling modes can be selected in future.

Methods of automatically tracking a patching connection between a first connector port of a patch panel and a second connector port of a network device are provided in which a sensor is used to detect that a first end of a patch cord has been inserted into the second connector port. The patch cord has at least one data communications channel and a separate control channel. A first conductor of the control channel of the patch cord is biased to power an integrated circuit chip on the network device. In response to the detection by the sensor, a first signal is transmitted over the separate control channel of the patch cord to the network device. A second signal is received over the control channel of the patch cord in response to the first signal. The second signal includes a unique identifier that is associated with the second connector port.

An increased connector port density assembly is disclosed for providing more connector ports than would normally fit on a faceplate. The increased connector port density assembly includes a stationary board and an extendable board connected to the stationary board on rails and with cabling. The extendable board has a first and second set of forward facing connector assemblies. The first set accessible when the extendable board is in either the retracted or extended position, whereas the second set of connector assemblies is accessible when the extendable board is in the extended position. The increased connector port density assembly is particularly useful for overcoming faceplate connector area availability limitations known in the art.

Disclosed are a method and a system for remote wake-up and status check, with a wake-up signal generating unit generating and transmitting a wake-up signal to wake up an electricity supply unit of a remote device to operate normally and provide electricity for the remote device. The wake-up signal has an assigned electric voltage with specific characteristics for detection by the electricity supply unit while in power-off mode and, upon signal detection, the electricity supply unit wakes up to provide normal electric voltage output. The wake-up signal generating unit determines, according to an electric current on a wake-up signal feed line, whether the remote device is in an active mode. A low wake-up energy consumption enables system wake-up and a true powered-off sleep mode.

The invention discloses an acquisition method and system for reducing network traffic in a power system. The method comprises the following steps: S1, equipment integration; s2, carrying out network acquisition; step S3, traffic processing; s4, filtering the flow; s5, forwarding the traffic; and S6, flow monitoring. A plurality of network devices are integrated together to form the integration body, so that the purpose of reducing network flow can be achieved in the process of collecting network data, and the combined network device integration body has the advantages of being high in port density, rich in working mode, flexible in high-performance deployment, convenient to manage and maintain and the like. The system can adapt to various application environments, supports various flow monitoring models, provides multi-interface integrated convergence monitoring, one-to-many copy monitoring, uplink and downlink separation monitoring and load balancing homologous homoclinic shunt output monitoring, and can identify useless content flow and discard useless flow in the flow processing process.