Curable composition and method for manufacturing the same

Active Publication Date: 2014-08-21
ETERNAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a curable composition that includes an organopolysiloxane having at least two silicon-bonded alkenyl groups and a polymer having at least two silicon-bonded alkenyl groups. The composition also includes a branched organopolysiloxane having at least one silicon-bonded alkenyl group and a siloxane unit of formula R4SiO3 / 2. The composition further includes a catalyst. The technical effect of this invention is to provide a curable composition that has good properties such as high adhesion, high elongation, and good flexibility, which can be used as the packaging material of a light emitting diode.

Problems solved by technology

Such curable organopolysiloxane compositions, due to their high viscosities, have disadvantages including operation difficulty and poor adhesive property to the substrate.
However, during the synthesis of the above component, a great amount of nonreactive residue of methyl phenyl rings is inevitably generated for the reaction equilibrium, which will make the surface of the cured product obtained from the composition sticky.
In addition, any procedure used to remove the rings, such as a high-temperature distillation, will probably lead to the breakage of the bonding between the phenyl groups and result in the appearance of yellowing.
Furthermore, since the added component is a linear organopolysiloxane with insufficient strength, the cured product will tend to fracture under a high temperature or a drastic temperature variation.

Method used

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  • Curable composition and method for manufacturing the same
  • Curable composition and method for manufacturing the same
  • Curable composition and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0074]The obtained component (A) was mixed with the following components to prepare a curable composition 1 (viscosity: 2,824 mPa·sec):

component (A): 7 parts by weight;

component (B): an organopolysiloxane (65 parts by weight; solid at 25° C.) with an average molecular weight of 1,729, a silicon-bonded phenyl group content of 57% by mole, a silicon-bonded vinyl group content of 4.07% by weight, and the following structure:

(C6H5SiO3 / 2)0.8[(CH2═CH)(CH3)2SiO1 / 2]0.2;

component (C): an organopolysiloxane (24 parts by weight) with the following structure:

H(CH3)2SiO[(C6H5)2Si]OSi(CH3)2H;

component (D): a complex of Pt and 1,3-divinyl-1,1,3,3-tetramethoxyldisiloxane, used in an amount such that the concentration of Pt was about 1.5 ppm; and

component (E): 1-acetenyl-1-cyclohexanol (0.05 parts by weight) for uniformly mixing the components.

example 2

[0075]The preparation procedures of Example 1 were repeated except for changing the amounts of components (A), (B) and (C) as follows (the amounts of the rest of the components were not changed). Curable composition 2 (viscosity: 3,218 mPa·sec) was obtained.

component (A): 13 parts by weight;

component (B): 60 parts by weight; and

component (C): 23 parts by weight.

example 3

[0076]The preparation procedures of Example 1 were repeated except for changing the amounts of components (A), (B) and (C) as follows (the amounts of the rest of the components were not changed). Curable composition 3 (viscosity: 3,684 mPa·sec) was obtained.

component (A): 21 parts by weight;

component (B): 53 parts by weight; and

component (C): 22 parts by weight.

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Abstract

A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I′):(R12SiO2 / 2)a1(R23SiO1 / 2)b1(CH2CH2)e1;(B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3 / 2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2 / 2)f(R63SiO1 / 2)g(R7SiO3 / 2)h(SiO4 / 2)i(CH2CH2)j; and (D) a catalyst, wherein R1, R2 and R4 to R7 and a1, b1, e1 and f to j are as defined in the specification.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS[0001]This application is a continuation-in-part application claiming the benefit of U.S. Ser. No. 13 / 302,512, filed on Nov. 22, 2011, the subject matter of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a curable composition. In particular, the present invention relates to a curable composition, which is suitable for use as the packaging material of electronic components such as light emitting diodes.[0004]2. Descriptions of the Related Art[0005]Organic resin, due to its properties of high processability, light weight, low cost and impact resistance etc., has gradually replaced inorganic glass for use as optical components such as optical lens and packaging materials of electronic components. Recently, due to the development of light emitting diode techniques (e.g., high brightness, multiple color property etc.), organic silicon resins which have bette...

Claims

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Application Information

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IPC IPC(8): C08L83/04H01L31/0203H01L23/29H01L33/56
CPCC08L83/04H01L23/296H01L31/0203H01L33/56C08G77/12C08G77/20C08G77/70C08K5/56C08L83/00
InventorYANG, CHIH CHIANGLIANG, KWEI WENCHEN, HSIN HUNGYANG, WAN HSI
OwnerETERNAL MATERIALS CO LTD