Heat dissipation device embedded within a microelectronic die

Abstract

The subject matter of the present application relates to a heat dissipation device that is embedded within a microelectronic die. The heat dissipation device may be fabricated by forming at least one trench extending into the microelectronic die from a microelectronic die back surface, which opposes an active surface thereof, and filling the trenches with at least one layer of thermally conductive material. In one embodiment, the heat dissipation device may be a thermoelectric cooling device.

Description

TECHNICAL FIELD[0001]Embodiments of the present description generally relate to the field of heat dissipation from a microelectronic die, and, more specifically, to a heat dissipation device embedded within the microelectronic die.BACKGROUND ART[0002]The microelectronic industry is continually striving to produce ever faster and smaller microelectronic dice for use in various mobile electronic products, such as portable computers, electronic tablets, cellular phones, digital cameras, and the like. As these goals are achieved, the density of power consumption of integrated circuit components within the microelectronic dice has increased, which, in turn, increases the average junction temperature of the microelectronic die. If the temperature of the microelectronic die becomes too high, the integrated circuits within the microelectronic die may be damaged or destroyed. In typical microelectronic dice, such as flip-chip type dice, heat is generally removed convectively with a heat spre...

AI Technical Summary

Benefits of technology

The present patent is about a heat dissipation device for microelectronic dice, which is designed to improve their cooling efficiency. The device is embedded within the microelectronic die and can be used in thin products like smartphones and tablets. The technical effect of this invention is to prevent damage to the integrated circuits within the microelectronic die caused by high temperatures, which can occur if there is insufficient heat dissipation. The device is designed to improve space utilization and cost-effectiveness, and can be used in various embodiments.

Problems solved by technology

As these goals are achieved, the density of power consumption of integrated circuit components within the microelectronic dice has increased, which, in turn, increases the average junction temperature of the microelectronic die.

If the temperature of the microelectronic die becomes too high, the integrated circuits within the microelectronic die may be damaged or destroyed.

However, when microelectronic dice are used in thin products, such as smart phones, tablets, ultrabook computers, and the like, space for the incorporation of such heat removal solutions is limited.

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