LED assembly with omnidirectional light field
a technology of led chips and assembly, applied in the direction of point-like light sources, semiconductor devices for light sources, lighting and heating apparatus, etc., can solve the problems of shortened lifespan, prone to performance degradation, or aging of led chips, and a kind of semiconductor produ
Inactive Publication Date: 2015-01-01
EPISTAR CORP +1
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- Application Information
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Benefits of technology
The patent describes a LED assembly that includes a substrate, LED chips, a circuit, and electrodes. The assembly also has a transparent capsule with phosphor dispersed inside, which is formed on the substrate and surrounds the circuit and LED chips. The technical effect of this assembly is the production of light that is more evenly distributed and has better color quality.
Problems solved by technology
LED chips, which are a kind of semiconductor products, are prone to performance degradation, or aging, if exposed for a long time in an atmosphere full of humidity or chemical.
Otherwise, heat accumulated in the PN junction of an LED chip will damage or degrade its performance, shortening its lifespan.
Method used
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[0043]An LED assembly 100 according to an embodiment of the disclosure is described in detail with reference to FIG. 1. The LED assembly 100 has a transparent substrate 106, which is for example an electrically non-conductive glass. The transparent substrate 106 has a top surface 102 and a bottom surface 104 facing to opposite orientations respectively. As shown in FIG. 1, the transparent substrate 106 is substantially in the form of a thin and longitudinal strip with two ends 114 and 116. In this specification, the term, transparent, only means admitting the passage of light and could also be referred to as translucent or semitransparent. Objects situated behind a transparent material in this specification might be distinctly or indistinctly seen. In other embodiments, the transparent substrate 106 is sapphire, ceramic material (ex. Al2O3 or AlN), silicon carbide (SiC), or diamond-like carbon (DLC). It is noted that the transparent substrate 106 can contain a plurality of thermal-c...
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Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.
Description
CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority to and the benefit of Taiwan Application Series Number 102122873 filed on Jun. 27, 2013 and Taiwan Application Series Number 103111887 filed on Mar. 27, 2014, which are incorporated by reference in their entirety.BACKGROUND[0002]The present disclosure relates generally to light emitting diode (LED) assemblies, and more specifically, to LED assembly that has an omnidirectional light field.[0003]LED has been used in different kinds of appliances in our daily life, such as traffic lights, car headlights, street lamps, computer indicators, flashlights, LCD backlight modules, and so on. Beside the semiconductor manufacturing process in the front end, the LED chips used in these appliances should go through LED packaging in the back end.[0004]LED packaging mainly provides mechanical, electrical, thermal, and optical supports to LED chips. LED chips, which are a kind of semiconductor products, are prone to perform...
Claims
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IPC IPC(8): F21K99/00H01L33/50
CPCH01L33/50F21K9/56F21K9/00F21K9/135F21K9/90F21V19/003F21Y2101/02F21Y2103/003F21Y2111/001H01L25/0753H01L2224/32225H01L2224/48091H01L2224/48137H01L2224/48227H01L2224/73265H05K1/117H05K3/285H05K3/326H05K3/3405H05K3/366H05K2201/09481H05K2201/10674F21Y2103/10F21Y2107/00F21K9/232F21Y2115/10F21Y2101/00H01L2924/00014H01L2224/48464H01L24/29H01L24/32H01L24/48H01L24/49H01L24/73H01L2224/2929H01L2224/29386H01L2224/29393H01L2224/49109H01L2924/12032H01L2924/12035H01L2924/12042H01L2924/12036H01L2924/12041H01L2924/181H01L2924/00012H01L2224/45099H01L2924/0665H01L2924/0715H01L2924/00
Inventor LIU, HONG-ZHIKUO, YI-TINGCHENG, TZU-CHI
Owner EPISTAR CORP