Multilayer ceramic device having a crack guide pattern
a multi-layer ceramic and guide pattern technology, applied in the manufacture of fixed capacitors, fixed capacitor details, fixed capacitors, etc., can solve the problems of internal voids, cracks in the device body, and the no longer difficult operation of multi-layer ceramic devices as devices
Inactive Publication Date: 2016-04-21
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF3 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
The present invention aims to provide a ceramic device that can still function even if it gets damaged due to an external impact. The invention also provides a method for manufacturing this ceramic device.
Problems solved by technology
Therefore, when the physical or thermal impact is applied to the multilayer ceramic device, cracks occur in the device body.
When the cracks mainly start from a surface of the device body which is adjacent to an end of the external electrode and then progress to an inside of the device body and the cracks progress to an active region within the device body, the multilayer ceramic device is no longer difficult to perform a function as a device.
However, since the intermediate layer is made of a mixed material of metal and polymer resin, the polymer resin is thermally decomposed during a reflow or wave soldering process for mounting the chip component to space between the internal metal layer and the intermediate layer, thereby causing an internal void.
However, in order to apply the reinforcing pattern, the number of stacked patterns within the device body is increased, such that manufacturing cost of the device may be increased and a dielectric thickness may be relatively decreased, thereby making it difficult to implement the high-capacity device.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
example
[0043]500 multilayer ceramic devices having 1 nF capacity of a size 1.6 mm×0.8 mm×0.8 mm were manufactured. In this case, as the crack guide pattern, a nickel metal pattern was formed on a single dielectric sheet which forms a sheet laminate of the device body, during the process of manufacturing a device body. Further, a thickness T2 of the oxide layer to a thickness T1 of the crack guide pattern was controlled by controlling the supply amount of the oxygen gas which is used during the firing process for the device body. A ratio of the thickness T2 of the oxide layer to the thickness T1 of the crack guide pattern means an oxidized degree (T2 / T1) for the nickel metal pattern, in which the oxidized degree (T2 / T1) was controlled as shown in Table 1.
[0044]The warpage strength was evaluated by warping 50 samples up to 5 mm at a speed of 1 mm / sec for each condition and then confirming the number of samples guided along the crack guide pattern via a final crack path by an internal destruc...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| speed | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| extending length | aaaaa | aaaaa |
Login to View More
Abstract
Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern.
Description
[0001]This application is a Continuation application of U.S. Ser. No. 14 / 175,129 filed Feb. 7, 2014, which claims foreign priority benefit under 35 U.S.C. Section 119 of Korean patent Application Serial No. 10-2013-0015427 entitled “Multilayer Ceramic Device and Method For Manufacturing The Same” filed on Feb. 13, 2013, which are hereby incorporated by reference in their entireties into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a multilayer ceramic device and a method for manufacturing the same, and more particularly, to a multilayer ceramic device capable of preventing a function of a device from deteriorating due to occurrence of crack, and a method for manufacturing the same.[0004]2. Description of the Related Art[0005]A chip component, such as a general thin film type multilayer ceramic condenser (MLCC) is configured of a device body, an internal electrode, an external electrode, and the like. The device body has a...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(United States)
IPC IPC(8): H01G4/002C23C8/12H01G4/008H01G4/30H01G4/12
CPCH01G4/002H01G4/306C23C8/12H01G4/008H01G4/12H01G4/012H01G4/30H01G13/00
Inventor CHUNG, HAE SOCKKIM, DOO YOUNGHA, NA RIMKIM, CHANG HOONPARK, SANG HYUN
Owner SAMSUNG ELECTRO MECHANICS CO LTD