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Modules for heat exchange for use in cooling towers

a technology for cooling towers and modules, which is applied in the direction of trickle coolers, efficient regulation technologies, light and heating apparatus, etc., can solve the problems of high labor intensity of towers, high labor intensity of dedicated labor force, and high labor intensity of assembly at the job si

Inactive Publication Date: 2017-01-05
SPX COOLING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present patent provides methods for assembling a cooling tower with a heat exchange module that can be counter-flow or cross-flow cooling towers. The heat exchange module includes a structural system comprising a plurality of structural members that provide compression and tension support. The module can be transported using a carrier and can be placed on a cold water basin or air inlet structure for assembly. The invention provides a more efficient and easier way to assemble cooling towers with a heat exchange module.

Problems solved by technology

A drawback associated with current cooling towers is that they are typically very labor intensive in their assembly at the job site.
The assembly of such towers oftentimes requires a dedicated labor force investing a large amount of hours.
Accordingly, such assembly is labor intensive requiring a large amount of time and therefore can be costly.
Uncertainties such as weather and site conditions may also affect the time required to assemble cooling towers at a job site.
The quality of the labor force may also lead to quality and performance issues associated with the towers.
But while it may be desirable to assemble tower components at a factory, conventional designs for cooling towers oftentimes necessitate their assembly at a job site.
For example, factors such as the size of the various tower components and their structural strength may limit their ability to be manufactured at the factory and transported onsite.

Method used

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  • Modules for heat exchange for use in cooling towers
  • Modules for heat exchange for use in cooling towers
  • Modules for heat exchange for use in cooling towers

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Embodiment Construction

[0029]In the following detailed description, reference is made to the accompanying drawings, which form a part hereof and show by way of illustration specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice them, and it is to be understood that other embodiments may be utilized, and that structural, logical, processing, and electrical changes may be made. It should be appreciated that any list of materials or arrangements of elements is for example purposes only and is by no means intended to be exhaustive. The progression of processing steps described is an example; however, the sequence of steps is not limited to that set forth herein and may be changed as is known in the art, with the exception of steps necessarily occurring in a certain order.

[0030]Cooling towers regulate the temperature of relatively warm or hot fluid by passing the fluid through a tower apparatus that bring...

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Abstract

The present disclosure relates to modules for heat exchange for use in cooling towers and methods of assembling cooling towers using such modules. The aforementioned modules for heat exchange may include fill packing and a triangular support structure comprising a plurality of structural members. The aforementioned modules for heat exchange may be assembled prior to being transported to a job site and installed in a cooling tower. The triangular support structure may be configured to provide support for the heat exchange module when the heat exchange module is transported. In other aspects of the present disclosure, the aforementioned modules for heat exchange may include a firewall structure configured to withstand dynamic loads when the heat exchange module is transported.

Description

FIELD OF THE INVENTION[0001]The present disclosure relates generally to modules for heat exchange for use in cooling towers. The present disclosure also relates to methods of assembling cooling towers using modules for heat exchange. More particularly, the present disclosure relates, for example, to fill layer modules that can be pre-assembled in a factory setting and transported to a job site and installed in a cooling tower.BACKGROUND OF THE INVENTION[0002]Cooling towers are heat exchangers of a type widely used to emanate low grade heat into the atmosphere and are typically utilized in electricity generation, air conditioning installations, and the like. These towers receive a relatively warm or hot fluid, and pass the fluid through the tower apparatus so that heat is extracted from the fluid by interaction with relatively cooler ambient air.[0003]Cooling towers generally include counter-flow type cooling towers and cross-flow type cooling towers. In a counter-flow cooling tower,...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F9/007
CPCF28C1/00F28F25/08Y02B30/70E04H5/12
Inventor JIANG, HONGJUNPISKURIC, ANDJELKO
Owner SPX COOLING TECH