Parallel-connected condenser and cooling device using the same

Abstract

A cooling device includes a parallel-connected condenser and an evaporator assembly. The parallel-connected condenser has a primary condenser assembly and at least one auxiliary condenser assembly. The evaporator assembly includes an evaporator, a coolant input pipe and a coolant output pipe. Two ends of the coolant input pipe are respectively connected to the evaporator and a first primary condenser tube. Two ends of the coolant output pipe are respectively connected to the evaporator and a second primary condenser tube for the parallel-connected condenser and the evaporator assembly to form a closed coolant circulation loop with coolant filled therein. By virtue of the primary condenser assembly and the auxiliary condenser assembly parallelly connected, gaseous coolant can be circulated through different paths and liquefied to effectively enhance cooling and liquefaction efficiency of coolant when the coolant is circulated through the cooling device.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]The present invention relates to a parallel-connected condenser and a cooling device using the same and, more particularly, to a parallel-connected condenser with enhanced cooling performance and a cooling device using the same.2. Description of the Related Art[0002]As we know, heat is generated by electronic devices when the electronic devices are operating. To lower the chance of irregular operation or damage to an electronic device arising from an overheat condition, by and large a cooling device is installed at a heat-generating source of the electronic device to absorb heat generated by the heat-generating source to achieve a cooling purpose.[0003]Conventionally, such cooling device includes an evaporator, a condenser and multiple coolant pipes connected with the evaporator and the condenser to form a closed circulation loop with coolant filled inside the circulation loop. Thus, the coolant in the evaporator absorbs heat...

AI Technical Summary

Benefits of technology

The present invention provides a parallel-connected condenser and a cooling device using the same to enhance the flow rate of coolant and improve cooling performance. The parallel-connected condenser can be used in a regular cooling device or a cooling device for electronic devices. The cooling effect on objects or devices can be enhanced by separate paths for coolant to flow through the primary and auxiliary condensers of the parallel-connected condenser. The pressure of the coolant inside the closed coolant circulation loop increases with the temperature rise of the heat-generating source, and the amount of gaseous coolant increases with the temperature rise. The high pressure of the gaseous coolant forces a part of the gaseous coolant to enter the auxiliary condenser, and the separate flow paths and simultaneous cooling increase the liquefaction efficiency of the cooling device. The coolant flows through different paths and changes phase upon circulation, achieving enhanced cooling performance.

Problems solved by technology

As the conventional cooling device only has one condenser, the flow rate of the gaseous coolant may be limited.

Therefore, when the coolant inside the evaporator is heated and the amount of the gaseous coolant is beyond a cooling capacity that the condenser can provide, the resultant cooling efficacy of the cooling device fails to be satisfactory.

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