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Multi-connection device and multi-connection method

a multi-connection device and multi-connection technology, applied in the field of multi-connection method and multi-connection device, can solve the problems of inflexible traditional method to apply different applications, connect to another, etc., and achieve the effect of enhancing the application of sound devices

Inactive Publication Date: 2019-05-02
HTC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent is about a device that can control the output of voices from sound devices based on different modes, such as whispering, volume up, and translation. The device can switch among these modes manually or through RSSI or Usonic detection. The device allows for direct connections between electronic devices and sound devices without the need for other devices to connect them. This enhances the flexibility and application of sound devices.

Problems solved by technology

However, the traditional method is not flexible to apply different applications.
For example, the speaker connected to the smart phone is hard to connect to another speaker when a distance between these two speakers is too far.

Method used

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  • Multi-connection device and multi-connection method
  • Multi-connection device and multi-connection method
  • Multi-connection device and multi-connection method

Examples

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Embodiment Construction

[0011]Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

[0012]It will be understood that, although the terms “first,”“second,” etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the embodiments.

[0013]It will be understood that, in the description herein and throughout the claims that follow, when an element is referred to as being “connected” or “electrically connected” to another element, it can be directly connected to the other element or intervening elements may be present. In c...

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Abstract

The multi-connection method includes following steps: simultaneously establishing a first connection with a right channel unit of a headphone and a second connection with a left channel unit of the headphone during a connection time by a Bluetooth module; processing a first electrical signal transmitted via the first connection or a second electrical signal transmitted via the second connection by a processor; wherein the processor is coupled to the Bluetooth module; wherein the processor adjusts the first electrical signal to generate the second electrical signal.

Description

[0001]This application claims the benefit of U.S. provisional application Ser. No. 62 / 579,904, filed Nov. 1, 2017, the disclosure of which is incorporated by reference herein in its entirety.FIELD OF INVENTION[0002]The present invention relates to a multi-connections method and a multi-connection device. More particularly, the present invention relates to a multi-connection method and a multi-connection device for connecting the multiple sound devices by an electronic device.DESCRIPTION OF RELATED ART[0003]Recently, the sound devices, e.g., speaker and external microphone, are becoming common peripheral accessories of smart phone. In general, the traditional method for connecting one smart phone to two speakers is that the smart phone connects to one speaker firstly, and then the speaker connects to another speaker to finish the connections.[0004]However, the traditional method is not flexible to apply different applications. For example, the speaker connected to the smart phone is ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H04W76/15H04W4/80H04B17/318H04M1/72412
CPCH04B17/318H04W76/15H04W4/80G06F3/167H04M1/6066G06F40/58H04M2242/12G06F3/16H04M2250/02H04M2203/2061G10L15/08H04M1/72412
Inventor LEE, HSIN-HAOLEE, CHING-HAOYANG, HSIU-PO
Owner HTC CORP