Loop heat pipe structure

a technology of heat pipe and loop, which is applied in the direction of heat transfer modification, indirect heat exchanger, light and heating apparatus, etc., can solve the problems of not always suitable for use with electronic apparatuses, gas-phase working fluid in the vaporization chamber cannot be quickly delivered via the vapor pipe, and the conventional vapor pipe does not provide more space for working fluid, etc., to achieve the effect of improving the heat dissipation

Inactive Publication Date: 2019-05-23
ASIA VITAL COMPONENTS (CHINA) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an improved loop heat pipe structure that allows more gas-phase working fluid to escape, resulting in an upgraded cooling effect. The design also ensures that the amount of gas-phase fluid is balanced with the amount of liquid-phase fluid, leading to better heat dissipation.

Problems solved by technology

While the fans indeed enable upgraded heat dissipation effect, they are not always suitable for use with the electronic apparatus that have a limited or narrow internal space.
That is, the conventional vapor pipe does not provide more space for the working fluid in gas phase to flow therethrough.
As a result, the gas-phase working fluid in the vaporization chamber could not be quickly delivered via the vapor pipe to the condensation device for condensing into the liquid-phase working fluid while the condensed liquid-phase working fluid has already flowed from the condensation device back to the vaporization chamber.

Method used

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Examples

Experimental program
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Effect test

first embodiment

[0030]The evaporator 110 internally defines a vaporization chamber 115, in which a first wick structure 117 is provided and a working fluid 170 is filled. In the illustrated first embodiment, the first wick structure 117 separates the vaporization chamber 115 into a liquid chamber 115a and a vapor chamber 115b. The liquid chamber 115a is located adjacent to the at least one liquid pipe 150 and stores the working fluid 170 that is in a liquid phase. The vapor chamber 115b is located adjacent to the at least one vapor pipe 130 and allows the working fluid 170 in a gas phase to flow therethrough. The first wick structure 117 includes a plurality of grooves 117a, via which the gas-phase working fluid 170 flows to the vapor chamber 115b.

[0031]The at least one vapor pipe 130 has a first end 131 and a second end 133 located at two opposite ends of the vapor pipe 130. The first end 131 of the vapor pipe 130 is communicable with an end of the vaporization chamber 115 of the evaporator 110 h...

second embodiment

[0037]Further, in the illustrated second embodiment, the condensing section 190 is internally provided with a third wick structure 196, which is capillarily connected to the second wick structure 156. Herein, the description “is capillarily connected to” means the second and the third wick structure 156, 196 are in material contact or connection with each other, such that pores in the second wick structure 156 are communicable with pores in the third wick structure 196 and a capillary force of the third wick structure 196 can be transmitted or extended to the second wick structure 156, enabling the liquid-phase working fluid 170 to flow from the condensing section 190 back to the liquid chamber 115a due to the capillary force.

[0038]The condensation chamber 194 can receive and cool more gas-phase working fluid 170 at a time, and the capillary force of the second and third wick structures 156, 196 enables the liquid-phase working fluid 170 to more quickly flow back to the liquid chamb...

sixth embodiment

[0046]As can be seen in FIG. 8a, in the illustrated sixth embodiment, a grand total of the cross-sectional areas of the vapor pipes 130 is larger than the total cross-sectional area of the one single liquid pipe 150.

[0047]With the plurality of vapor pipes 130, an increased amount of gas-phase working fluid 170 can be guided out of the evaporator 110 into the condensation chamber 194 for cooling, enabling the loop heat pipe structure 10 of the present invention to have largely upgraded heat dissipation effect.

[0048]FIG. 9 is a sectional top view of a loop heat pipe structure 10 according to a seventh embodiment of the present invention, and FIG. 9a includes sectional views taken along two lines C-C of FIG. 9, showing the cross-sectional areas of a plurality of vapor pipes 130 and the cross-sectional areas of a plurality of liquid pipes 150 of the loop heat pipe structure 10 according to the seventh embodiment of the present invention. Please refer to FIGS. 9 and 9a along with FIG. 8....

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PUM

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Abstract

A loop heat pipe structure includes an evaporator internally defining a vaporization chamber, in which a first wick structure is provided and a working fluid is filled; at least one vapor pipe having a first end and a second end, and the first end being communicable with an end of the evaporator; and at least one liquid pipe having a third end and a fourth end, the third end being communicable with the second end of the at least one vapor pipe and forming a condensing section, and the fourth end being communicable with another end of the evaporator. The evaporator, the at least one vapor pipe and the at least one liquid pipe together form a loop for the working fluid; and a grand total cross sectional area of the at least one vapor pipe is larger than that of the at least one liquid pipe.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a loop heat pipe structure, and more particularly to a loop heat pipe structure that increases the amount of gas-phase working fluid flowing out of an evaporator of the loop heat pipe structure.BACKGROUND OF THE INVENTION[0002]While the currently available electronic apparatus have increasingly upgraded performance, the electronic elements of these high-performance electronic apparatus for signal processing and data computing also produce more heat than the electronic elements of the conventional electronic apparatus. Generally, the most commonly adopted heat dissipation elements include heat pipes, heat sinks and vapor chambers. These heat dissipation elements are so arranged that they are in direct contact with the heat-producing electronic elements in order to provide further enhanced heat dissipation effect and prevent the electronic elements from being burnt out due to overheating. In many cases, fans with forced heat...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28F13/08F28D15/04
CPCF28D15/0266F28F13/08F28D15/04F28D2021/0028
Inventor LIN, YUAN-YI
Owner ASIA VITAL COMPONENTS (CHINA) CO LTD
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