Electroless copper plating compositions and methods for electroless plating copper on substrates

a technology of electroless plating and copper, applied in the direction of liquid/solution decomposition chemical coating, metal material coating process, coating, etc., can solve the problems of bath instability, difficult control of baths, and inability to maintain substantially uniform copper deposits over long periods of time, etc., to achieve good through-hole wall coverage, increase electroless copper plating rate, and low cost

Inactive Publication Date: 2019-12-19
ROHM & HAAS ELECTRONICS MATERIALS LLC
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0013]The imidazolium compounds enable increased electroless copper plating rates at low plating temperatures of less than or equal to 40° C. The electroless copper plating compositions and methods of the present invention further enable good through-hole wall coverage, even at low plating temperatures. Low plating temperatures reduce consumption of electroless copper plating composition additives which occur by undesired side reactions or decompose, thus providing a more stable electroless copper plating composition, and lower the cos

Problems solved by technology

Control of the baths to maintain high plating rates with substantially uniform copper deposits over long periods of time is exceedingly difficult.
In general, electroless copper plating rates of greater than 0.6 μm/5 min. are highly desirable but rarely achieved, especially at low electroless plating temperatures, such as below 40° C. Consumption and replenishment of bath components over several metal turnovers (MTO) can also contribute to bath instability, for example, through the buildup of side products.
Therefore, such baths, and particularly those having a high plating potential, i.e. highly active baths, tend to become unstable and to spontaneously decompose with use.
Such electroless copper bath instability can result in non-uniform or discontinuous copp

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electroless copper plating compositions and methods for electroless plating copper on substrates
  • Electroless copper plating compositions and methods for electroless plating copper on substrates

Examples

Experimental program
Comparison scheme
Effect test

example 1

Electroless Copper Plating Rates of an Electroless Copper Plating Baths Containing 1-Benzyl-3-Methylimidazolium Chloride

[0061]Four (4) electroless copper plating baths are prepared. All four baths include the following components:

TABLE 1Bath 4ComponentBath 1Bath 2Bath 3(Control)Copper sulfate10g / L10g / L10g / L10g / LpentahydrateRochelle salts40g / L40g / L40g / L40g / LSodium hydroxide8g / L8g / L8g / L8g / LFormaldehyde4g / L4g / L4g / L4g / L2,2′-ditho-0.5ppm0.5ppm0.5ppm0.5ppmdisuccinic acid1-benzyl-3-2.5ppm10ppm20ppm—methylimidazoliumchlorideWaterTo oneTo oneTo oneTo oneliterliterliterliter

The pH of each bath is 13. Bath 4 is a control. Each bath is used to plate copper on epoxy substrates. Each epoxy substrate is first treated according to the following process prior to electroless copper plating:[0062](1) Conditioner 231 applied for 1.5 min. at 45° C.;[0063](2) Rinse with DI water for 2 min. at room temperature;[0064](3) Nitric acid pre-dip, pH=2, for 0.5 min. at room temperature;[0065](4) 100 ppm of CIRCU...

example 2

Electroless Copper Plating Rates of an Electroless Copper Plating Baths Containing 1-Benzyl-3-Methylimidazolium Chloride and Guanidine Hydrochloride

[0069]Six (6) electroless copper plating baths are prepared. The pH of each bath is 13. The baths include the components and amounts as shown in Table 3.

TABLE 3Bath 10ComponentBath 5Bath 6Bath 7Bath 8Bath 9(Control)Copper sulfate pentahydrate10g / L10g / L10g / L10g / L10g / L10g / LRochelle salts40g / L40g / L40g / L40g / L40g / L40g / LSodium hydroxide8g / L8g / L8g / L8g / L8g / L8g / LFormaldehyde4g / L4g / L4g / L4g / L4g / L4g / L2,2′-dithio-disuccinic0.5ppm0.5ppm0.5ppm0.5ppm0.5ppm0.5ppmacidGuanidine hydrochloride0.4ppm0.4ppm0.4ppm0.4ppm0.4ppm0.4ppm1-benzyl-3-methylimidazolium2.5ppm5ppm10ppm15ppm20ppm—chlorideWaterTo oneTo oneTo oneTo oneTo oneTo oneliterliterliterliterliterliter

Each bath is used to plate copper on epoxy substrates. Each epoxy substrate is treated prior to electroless copper plating as described in Example 1. Electroless copper plating is done at 34° C. for 5 mi...

example 3

Backlight Experiment with Aqueous Alkaline Electroless Cooper Compositions of the Present Invention Containing 1-Benzyl-3-Methylimidazolium Chloride

[0071]The following aqueous alkaline electroless copper compositions of the invention are prepared having the components and amounts disclosed in Table 5. Bath 11 has a pH=12.5 at room temperature as measured using a conventional pH meter available from Fisher Scientific.

TABLE 5ComponentBath 11Copper sulfate pentahydrate10g / LRochelle salts40g / LSodium hydroxide8g / LFormaldehyde4g / L2,2′-dithiosuccinic acid0.5ppmGuanidine hydrochloride0.4ppm1-benzyl-3-methylimidazolium chloride10ppmWaterOne liter

[0072]Six (6) different FR / 4 glass epoxy panels with a plurality of through-holes are provided: TUC-662, SY-1141, IT-180, 370HR, EM825 and NPGN. The panels are either four-layer or eight-layer copper-clad panels. TUC-662 is obtained from Taiwan Union Technology, and SY-1141 is obtained from Shengyi. IT-180 is obtained from ITEQ Corp., NPGN is obtaine...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Temperatureaaaaaaaaaa
Fractionaaaaaaaaaa
Fractionaaaaaaaaaa
Login to view more

Abstract

Stable electroless copper plating baths include imidazolium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

Description

FIELD OF THE INVENTION[0001]The present invention is directed to electroless copper plating compositions and methods for electroless plating copper on substrates, wherein electroless copper plating has a high electroless copper plating rate at low temperatures and the electroless copper plating compositions are stable. More specifically, the present invention is directed to electroless copper plating compositions and methods for electroless plating copper on substrates, wherein electroless copper plating has a high electroless copper plating rate at low temperatures and the electroless copper plating compositions are stable, wherein the electroless copper plating compositions include imidazolium compounds or salts thereof.BACKGROUND OF THE INVENTION[0002]Electroless copper plating baths are in widespread use in metallization industries for depositing copper on various types of substrates. In the manufacture of printed circuit boards, for example, the electroless copper baths are use...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C23C18/40
CPCC23C18/405C23C18/40C23C18/30
Inventor LIFSCHITZ ARRIBIO, ALEJO M.GUMBLEY, PATRICIALIPSCHUTZ, MICHAELLIU, FENGMULZER, CATHERINEWEN, SARAH
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap