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Electroless copper plating compositions and methods for electroless plating copper on substrates

A technology for electroless copper plating and composition, applied in the field of electroless copper plating compositions and for electroless copper plating on substrates, can solve problems such as reducing the stability of electroless copper baths, achieve lower operating costs, lower consumption, The effect of good through-hole wall coverage

Active Publication Date: 2019-12-24
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increasing the operating temperature can reduce the stability of electroless copper baths by increasing the accumulation of by-products and reducing bath additives through side reactions, thus negating some of the effects of increasing stabilizer concentrations

Method used

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  • Electroless copper plating compositions and methods for electroless plating copper on substrates
  • Electroless copper plating compositions and methods for electroless plating copper on substrates
  • Electroless copper plating compositions and methods for electroless plating copper on substrates

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0065] Electroless Copper Plating Rates in Electroless Copper Baths Containing 1-Benzyl-3-methylimidazolium Chloride

[0066] Four (4) electroless copper plating baths were prepared. All four baths include the following components:

[0067] Table 1

[0068]

[0069] The pH of each bath was 13. Bath 4 was the control. Each bath is used to plate copper on epoxy substrates. Prior to electroless copper plating, each epoxy substrate was first treated according to the following process:

[0070] (1) Apply conditioner 231 at 45°C for 1.5 minutes;

[0071] (2) Rinse with deionized water for 2 minutes at room temperature;

[0072] (3) Apply nitric acid prepreg pH=2 at room temperature for 0.5 minutes;

[0073] (4) Apply 100ppm of CIRCUPOSIT at 40°C TM 6530 ionic palladium catalyst for 1 minute;

[0074] (5) Rinse with deionized water for 1 minute at room temperature;

[0075] (6) At 30° C., apply 5 g / L boric acid and 0.6 g / L dimethylamine borane aqueous solution for 1 min...

example 2

[0082] Electroless Copper Plating Rates of Electroless Copper Plating Baths Containing 1-Benzyl-3-methylimidazolium Chloride and Guanidine Hydrochloride

[0083] Six (6) electroless copper plating baths were prepared. The pH of each bath was 13. The baths included the components and amounts shown in Table 3.

[0084] table 3

[0085]

[0086] Each bath is used to plate copper on epoxy substrates. Each epoxy substrate was treated as described in Example 1 prior to electroless copper plating. Electroless copper plating was performed at 34°C for 5 minutes. Plating rate was determined by the same procedure as described in Example 1. Plating rates for each bath are shown in Table 4.

[0087] Table 4

[0088] bath Plating speed 5 0.74μm / 5min. 6 0.67μm / 5min. 7 0.79μm / 5min. 8 0.63μm / 5min. 9 0.7μm / 5min. 10 (control) 0.5μm / 5min.

[0089] Inclusion of 1-benzyl-3-methylimidazolium chloride in the electroless copper plating bat...

example 3

[0092] Backlight Experiments of Aqueous Alkaline Electroless Copper Compositions of the Invention Containing 1-Benzyl-3-Methylimidazolium Chloride

[0093] The following aqueous alkaline electroless copper compositions of the present invention having the components and amounts disclosed in Table 5 were prepared. The pH of bath 11 at room temperature = 12.5 as measured using a conventional pH meter available from Fisher Scientific.

[0094] table 5

[0095] components bath 11 copper sulfate pentahydrate 10g / L rochelle salt 40g / L sodium hydroxide 8g / L formaldehyde 4g / L 2,2'-dithiosuccinic acid 0.5ppm Guanidine hydrochloride 0.4ppm 1-Benzyl-3-methylimidazolium chloride 10ppm water 1 littre

[0096] Six (6) different FR / 4 glass epoxy boards with multiple through holes are available: TUC-662, SY-1141, IT-180, 370HR, EM825 and NPGN. Boards are four- or eight-layer copper-clad boards. TUC-662 was obtained from...

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Abstract

Stable electroless copper plating baths include imidazolium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

Description

technical field [0001] The present invention relates to an electroless copper plating composition and a method for electroless copper plating on a substrate, wherein the electroless copper plating has a high electroless copper plating rate at low temperature and the electroless copper plating composition is stable. More particularly, the present invention relates to electroless copper plating compositions and methods for electroless copper plating on substrates, wherein the electroless copper plating has a high electroless copper plating rate at low temperatures, and the electroless copper plating compositions are stable, Wherein the electroless copper plating composition includes an imidazolium compound or a salt thereof. Background technique [0002] Electroless copper plating baths are widely used in the metallization industry for depositing copper on various types of substrates. For example, in the manufacture of printed circuit boards, electroless copper baths are used...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
CPCC23C18/405C23C18/40C23C18/30
Inventor A·M·里夫希茨阿莱比奥P·冈布利M·利普舒兹F·刘C·穆尔泽S·文
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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