Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Stable electroless copper plating compositions and methods for electroless plating copper on substrates

A technology of electroless copper plating and composition, applied in the field of electroless copper plating composition and electroless copper plating on a substrate, to achieve the effect of reducing consumption and reducing operating costs

Active Publication Date: 2019-04-16
ROHM & HAAS ELECTRONICS MATERIALS LLC
View PDF4 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increasing the operating temperature destabilizes the electroless copper bath by increasing by-product accumulation and reducing bath additives through side reactions, thus negating some of the effects of increasing the stabilizer concentration

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stable electroless copper plating compositions and methods for electroless plating copper on substrates
  • Stable electroless copper plating compositions and methods for electroless plating copper on substrates
  • Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0060] Electroless Copper Compositions of the Invention The following aqueous alkaline electroless copper compositions were prepared with the components and amounts disclosed in Table 1 below.

[0061] Table 1

[0062]

[0063]

[0064] The pH of the aqueous alkaline electroless copper composition at room temperature = 12.7 as measured using a conventional pH meter available from Fisher Scientific.

example 2

[0066] Backlight experiment using aqueous alkaline electroless copper plating composition of the present invention

[0067] Four (4) each of six (6) different FR / 4 glass epoxy boards with multiple through holes are available: TUC-662, SY-1141, IT-180, 370HR, EM825, and NPGN. Boards are copper-clad four-layer or eight-layer boards. TUC-662 was obtained from Taiwan Union Technology, and SY-1141 was obtained from Shengyi. IT-180 was obtained from ITEQ Corp., NPGN was obtained from NanYa, 370HR was obtained from Isola, and EM825 was obtained from Elite Materials Corporation. Plate T g Values ​​range from 140°C to 180°C. Each plate is 5 cm x 12 cm.

[0068] The through hole processing of each board is as follows:

[0069] 1. CIRCUPOSIT for through-holes of each board TM Hole Prep 3303 solution was decontaminated at 80°C for 7 minutes;

[0070] 2. Then rinse the through holes of each board with flowing tap water for 4 minutes;

[0071] 3. Then place the vias with CIRCUPOSIT...

example 3

[0088] ICD Experiments Using the Aqueous Alkaline Electroless Copper Composition of the Invention Under Various MTOs

[0089] A plurality of six different copper-clad multilayer FR / 4 glass-epoxy boards with multiple vias were provided as in Example 2: TUC-662, SY-1141, IT-180, 370HR, EM825, and NPGN. The through hole processing of each board is as follows:

[0090] 1. Connect the through holes of each board with CIRCUPOSIT TM Hole Prep 3303 solution was decontaminated at 80°C for 7 minutes;

[0091] 2. Then rinse the through holes of each board with flowing tap water for 4 minutes;

[0092] 3. Then place the vias with CIRCUPOSIT TM MLB Promoter 3308 permanganate aqueous solution was treated at 80°C for 10 minutes;

[0093] 4. Then rinse the through hole with running tap water for 4 minutes;

[0094] 5. Then the through hole was treated with 3wt% sulfuric acid / 3wt% hydrogen peroxide neutralizer at room temperature for 2 minutes;

[0095] 6. Then rinse the through holes o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.

Description

technical field [0001] The present invention relates to stable electroless copper compositions and methods for electroless copper plating on substrates. More particularly, the present invention relates to a stable electroless copper plating composition and a method of electroless copper plating on a substrate, wherein the electroless copper plating composition comprises a selected carboxymethylthio compound as a stabilizer for electroless copper plating composition The compound provides stability without compromising electroless copper plating activity, even at low plating temperatures and high stabilizer and leaching catalyst concentrations. Background technique [0002] Electroless copper plating baths are widely used in the metallization industry to deposit copper on various types of substrates. In the manufacture of printed circuit boards, for example, electroless copper baths are used to deposit copper on the walls of vias and circuit paths as a substrate for subsequen...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
CPCC23C18/40C23C18/405C23C18/30C23C18/18
Inventor A·M·里夫希茨阿莱比奥D·E·克利里
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com