47results about How to "High plating rate" patented technology

The invention provides an electroplating PC/ABS (polycarbonate/acrylonitrile-butadiene-styrene) alloy material and a preparation method thereof. The electroplating PC/ABS alloy material comprises the following components in parts by weight: 30-70 parts of PC, 40-60 parts of ABS, 5-30 parts of styrene-acrylonitrile copolymer, 5-30 parts of butadiene graft rubber, 1-3 parts of compatilizer, 1-10 parts of heat-resistance modifier and 0.5-1 part of processing assistant. The alloy material provided by the invention has the advantages of favorable electroplating properties, excellent mechanical properties and favorable heat resistance, and can be used for designing automobile internal and external ornaments, including heat dissipation grids, door grips, vehicle logos, instrument panel decorating strips and the like.

The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Embodiments of the present invention provide methods for enhancing void-free metallic filling of narrow openings by electrochemical deposition (ECD). The methods provide enhanced replenishment of plating inhibitor at the field, while depleting the inhibitor inside narrow openings. The resulting inhibitor gradients facilitate void-free ECD filling of narrow openings with large aspect ratios. The inventive methods utilize vigorous electrolyte agitation at the field and top corners of the openings, while maintaining a relatively stagnant electrolyte inside the openings. Vigorous agitation is produced, for example, by high pressure jets flow and/or by mechanical means, such as brush (or pad, or wiper blade) wiping, or by a combination of jets and wiping brushes.

The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

Stable electroless copper plating baths include imidazolium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.

Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.

The present invention concerns a tin plating bath comprising tin ions; at least one complexing agent selected from the group consisting of pyrophosphate ions, linear polyphosphate ions and cyclic polyphosphate ions and a nitrogen and sulfur containing stabilizing additive and titanium (III) ions as a reducing agent suitable to reduce tin ions to metallic tin. The present invention further discloses a method of depositing tin or a tin alloy onto a surface of a substrate. The tin plating bath is particularly suitable to be used in the electronics and semiconductor industry.

A method and apparatus for regenerating a plating composition which is suitable for depositing at least one first metal on a substrate where the plating rate in the plating composition is very low, where the concentration of the at least one first metal in the plating composition cannot be easily set at a constant level, and where plating-out of the at least one first metal from the plating composition takes place. The method and apparatus for regenerating a plating composition is suitable for depositing at least one first metal on a substrate at a sufficiently high plating rate, while offering the opportunity to easily adjust the concentration of the at least one first metal in the plating composition at a constant level and to provide the plating composition with sufficient stability against decomposition thereof in order to safeguard the regeneration cell from plated-out first metal.

A plating apparatus includes a plating tank for storing a plating liquid, and applies a magnetic alloy plating to a shaft-shaped member immersed in the plating liquid by using the shaft-shaped member as a cathode. The plating apparatus further includes a routable member configured to rotate the shaft-shaped member as a rotary shaft; annular shielding tools mounted on the outer peripheral surface of the shaft-shaped member; a plating liquid discharge nozzle including plating liquid discharge ports which are provided to face the shaft-shaped member so as to avoid the shielding tools; and an anode provided around the shaft-shaped member and the plating liquid discharge nozzle.

Stable electroless copper plating baths include pyridinium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

A method of photoplating a metal contact onto a surface of a cathode of a photovoltaic device is provided using light induced plating technique. The method comprises: a) immersing the photovoltaic device in a solution of metal ions, where the metal ions are a species which is to be plated onto the surface of the cathode of the photovoltaic device; and b) illuminating the photovoltaic device, using a light source of time varying intensity. This results in nett plating which is faster in a direction normal to the surface of the cathode than in a direction in a plane of the surface of the cathode.

Electroplating apparatus agitates electrolyte to provide high velocity fluid flows at the surface of a wafer. The apparatus includes a paddle which provides uniform high mass transfer over the entire wafer, even with a relatively large gap between the paddle and the wafer. Consequently, the processor may have an electric field shield positioned between the paddle and the wafer for effective shielding at the edges of the wafer. The influence of the paddle on the electric field across the wafer is reduced as the paddle is spaced relatively farther from the wafer.