Electroless Plating in Microchannels

a microchannel device and electroless technology, applied in metal/metal-oxide/metal-hydroxide catalysts, hydrocarbon preparation catalysts, metal/metal-oxide catalysts, etc., can solve the problems of bubbles promoting non-uniformity of rh coating, difficult manufacturing of catalyst coatings with long-term mechanical and chemical stability, etc., to achieve simple plating process, low cost, and easy operation

Inactive Publication Date: 2014-08-07
VELOCYS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention provides a method for electrolesisily depositing rhodium onto a support using a solution containing rhodium and a promoter cation such as copper or lead. The method can be performed at room temperature and on any substrate, including microchannels. The plating process is simple and uses a small amount of ammonium hydroxide as the waste solution. The plated surface is not contaminated with chloride. The method can also be used to plate other metals such as platinum simultaneously. Overall, the invention offers a cost-effective and efficient way to deposit rhodium onto various substrates.

Problems solved by technology

Despite great efforts to produce microchannel apparatus suitable for industrial use, it is still reported that, in microreaction techology, the manufacture of catalyst coatings with long-term mechanical and chemical stability remains a challenge.
These plating processes are impractical for coating a microchannel device due to bubble formation and Rh precipitation.
Also the bubbles promote non-uniformity of the Rh coating.
The Rh precipitation also results in a high cost because Rh is expensive.
However, the Rh(NH3)6Cl3 is only slightly soluble in water and thus makes the plating process costly for handling so much waste liquid.
The deposition is executed preferably at a pH 8 to 9 at 70-95° C. The above processes are very expensive and also bring challenges for applying Rh plating in microchannel devices.
However, hydrazine is not stable in this system and thus needs to be added in situ.

Method used

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  • Electroless Plating in Microchannels
  • Electroless Plating in Microchannels

Examples

Experimental program
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Effect test

example 1

[0116]Ni-aluminide coupon (0.01 in×0.35 in×1 in) was heated to 1050° C. in flowing H2 at 3.5° C. / min heating rate. After purging with Ar for 1 hour at 1050° C., the gas is changed to 21% O2 / Ar. The coupon was heat-treated in flowing O2 / Ar for 10 hours and then cooled to room temperature. An α-Al2O3 scale was generated on the surface after the heat treatment. A solution consisting of Pt(NH3)4(NO3)2 (0.2 wt %Pt) and 0.2 wt % N2H4.H2O was prepared. The heat-treated coupon was put into the solution with stirring. The plating was performed at 60° C. for 7 hours. Subsequently, the coupon is rinsed with water and dried with blowing air. Around 2.2 mg / in2 of Pt was plated on the surface.

example 2

[0117]A solution containing Pt(NH3)4(OH)2 (0.2 wt % Pt) and 0.2 wt % N2H4H2O was prepared. An alloy 617 coupon (0.01 in×0.35 in×1 in) was hung in the solution at room temperature. The solution was stirred for 24 hours. Subsequently, the coupon was rinsed with water and dried with blowing air. The weight gain of the coupon was 8.5 mg / in2.

example 3

[0118]A Ni-aluminide coupon (0.02 in×0.2 in×1 in) was heated to 1050° C. in flowing H2 at 3.5° C. / min heating rate. After purging with Ar for 1 hour at 1050° C., the gas was changed to 21% O2 / Ar. The coupon was heat-treated in following O2 / Ar for 10 hours and then cooled to room temperature. An α-Al2O3 scale is generated on the surface after the heat treatment. The coupon was hung in a solution containing 0.2 wt % Pt as Pt(NH3)4(OH)2 and 0.2 wt % NaBH4 at room temperature. The solution was stirred for 5 hours. Subsequently, the coupon was rinsed with water and dried with blowing air. The weight gain of the coupon was 4.8 mg / in2.

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Abstract

Novel methods of electroless plating are described. Catalyst coatings can be applied within microchannel apparatus. Various reactions, including combustion and steam reforming, can be conducted over electroless catalyst coatings.

Description

RELATED APPLICATIONS[0001]This application claims the benefit of provisional patent application Ser. no. 60 / 727,112 filed 13 Oct. 2005.FIELD OF THE INVENTION[0002]This invention relates to electroless plating of metals, especially in microchannel apparatus. The invention also relates to methods of conducting reactions in microchannels.INTRODUCTION[0003]In recent years there has been tremendous academic and commercial interest in microchannel devices. This interest has arisen due to the advantages from microtechnology including reduced size, increased productivity, the ability to size systems of any desired capacity (i.e., “number-up”), increased heat transfer, and increased mass transfer. A review of some of the work involving microreactors (a subset of microchannel apparatus) has been provided by Gavrilidis et al., “Technology And Applications Of Microengineered Reactors,” Trans. IChemE, Vol. 80, Part A, pp. 3-30 (January 2002).[0004]Despite great efforts to produce microchannel ap...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B01J19/00C01B3/40B01J23/42C01B32/40
CPCB01J19/0053C01B3/40B01J23/42B01J19/0093B01J21/066B01J23/464B01J23/628B01J23/892B01J23/8926B01J37/0225B01J37/0226B01J37/0244B01J37/14B01J37/16B01J37/18B01J2219/00783B01J2219/00822B01J2219/00824B01J2219/00831B01J2219/00835B01J2219/00844B01J2219/0086B01J2219/00873B01J2219/00891C01B3/384C01B2203/0233C01B2203/0238C01B2203/0244C01B2203/0261C01B2203/0811C01B2203/0822C01B2203/0827C01B2203/1047C01B2203/107C01B2203/1241C07C5/48C07C2523/42C07C2523/46C23C18/1216C23C18/1644C23C18/1803C23C18/1817C23C18/44Y02P20/52C01B32/40Y02E60/36Y02P20/10Y02P20/141B01J35/393B01J35/30C07C11/04Y02T50/60
Inventor DALY, FRANCIS P.LONG, RICHARD Q.YANG, BARRY LEE-MEANMAZANEC, TERRY J.TAHA, RACHIDIDA, JUNKO
Owner VELOCYS INC
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