Electroless copper plating compositions and methods for electroless plating copper on substrates

Inactive Publication Date: 2019-12-19
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]The pyridinium compounds enable increased electroless copper plating rates at low plating temperatures of less than or equal to 40° C. The electroless copper plating compositions and methods of the present invention further enable good through-hole wall coverage, even at low plating temperatures. Low plating temperatures reduce consumption of electroless copper plating composition additives which occur by undesired side reactions or by decomposition, thus providing a more stable electroless copper plating composition, and lower th

Problems solved by technology

Control of the baths to maintain high plating rates with substantially uniform copper deposits over long periods of time is exceedingly difficult.
In general, electroless copper plating rates of equal to or greater than 0.6 μm/5 min. are highly desirable (preferably desired for current horizontal plating applications) but rarely achieved, especially at low electroless plating temperatures, such as below 40° C. Consumption and replenishment of bath components over several metal turnovers (MTO) can also contribute to bath instability, for example, through the buildup of side products.
Therefore, such baths, and particularly those having a high plating potential, i.e. highly active baths, tend to become unstable and to spontaneously decompose with use.
Such electroless copper bath instability can result in non-uniform or discontinuous copper plating along a surface.
Such discontinu

Method used

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  • Electroless copper plating compositions and methods for electroless plating copper on substrates
  • Electroless copper plating compositions and methods for electroless plating copper on substrates

Examples

Experimental program
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Effect test

example 1

Electroless Copper Plating Rates of an Electroless Copper Plating Baths Containing Pyridinium Compounds

[0061]Ten (10) electroless copper plating baths are prepared. All ten baths include the following components:

[0062]1. 10 g / L Copper sulfate pentahydrate

[0063]2. 40 g / L Rochelle salts

[0064]3. 8 g / L Sodium hydroxide

[0065]4. 4 g / L Formaldehyde

[0066]5. 0.5 ppm 2,2′-dithiodisuccinic acid

[0067]6. Water (balance)

The pH of each bath is 13. To nine (9) of the electroless plating compositions one of the following pyridinium compounds is added in the amount specified in Table 1. Bath 10 is a control where no pyridinium compounded is added.

TABLE 11-(3-sulfopropyl)1-butylpyridiniumpyridinium1-(4-pyridyl)Bathchloridehydroxidepyridinium chloride12.5 ppm ——210 ppm——320 ppm——4—2.5 ppm —5—10 ppm—6—20 ppm—7——2.5 ppm 8——10 ppm9——20 ppm

Each bath is used to plate copper on bare epoxy substrates of NP140 material (Nanya, Taiwan). Each epoxy substrate is first treated according to the following process pr...

example 3

Electroless Copper Plating Rates of an Electroless Copper Plating Baths Containing Pyridinium Compounds and Guanidine Hydrochloride

[0084]Fourteen (14) electroless copper plating baths are prepared. All fourteen baths include the following components:

[0085]1. 10 g / L Copper sulfate pentahydrate

[0086]2. 40 g / L Rochelle salts

[0087]3. 8 g / L Sodium hydroxide

[0088]4. 4 g / L Formaldehyde

[0089]5. 0.5 ppm 2,2′-dithiodisuccinic acid

[0090]6. 0.36 ppm Guanidine Hydrochloride

[0091]7. Water (balance)

The pH of each bath is 13. To thirteen (13) of the electroless plating compositions one of the following pyridinium compounds is added in the amount specified in Table 4. Bath 24 is a control where no pyridinium compounded is added.

TABLE 41-(3-sulfopropyl)1-butylpyridiniumpyridinium1-(4-pyridyl)Bathchloridehydroxidepyridinium chloride112.5 ppm ——12 5 ppm——1310 ppm——1415 ppm——1520 ppm——16—2.5 ppm —17— 5 ppm—18—10 ppm—19—15 ppm—20—20 ppm—21——2.5 ppm 22—— 5 ppm23——10 ppm

Each bath is used to plate copper on...

example 5

Backlight Experiment with Aqueous Alkaline Electroless Cooper Compositions of the Present Invention Containing Pyridinium Compounds

[0101]The following aqueous alkaline electroless copper compositions of the invention are prepared having the components and amounts disclosed in Table 7 below.

TABLE 7ComponentBath 25Bath 26Copper sulfate pentahydrate10g / L10g / LRochelle salts40g / L40g / LSodium hydroxide8g / L8g / LFormaldehyde4g / L4g / L2,2′-Dithiosuccinic acid0.5ppm0.5ppmGuanidine hydrochloride0.36ppm0.36ppm1-butylpyridinium chloride10ppm—1-(3-sulfopropyl)—10ppmpyridinium hydroxideWaterTo one literTo one liter

The pH of the aqueous alkaline electroless copper compositions have a pH=13 at room temperature as measured using a conventional pH meter available from Fisher Scientific.

[0102]Six (6) different FR / 4 glass epoxy panels with a plurality of through-holes are provided: TUC-662, SY-1141, IT-180, 370HR, EM825 and NPGN. The panels are eight-layer copper-clad panels. TUC-662 is obtained from Taiwan...

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Abstract

Stable electroless copper plating baths include pyridinium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

Description

FIELD OF THE INVENTION[0001]The present invention is directed to electroless copper plating compositions and methods for electroless plating copper on substrates, wherein electroless copper plating has a high electroless copper plating rate at low temperatures and the electroless copper plating compositions are stable. More specifically, the present invention is directed to electroless copper plating compositions and methods for electroless plating copper on substrates, wherein electroless copper plating has a high electroless copper plating rate at low temperatures and the electroless copper plating compositions are stable, wherein the electroless copper plating compositions include pyridinium compounds or salts thereof.BACKGROUND OF THE INVENTION[0002]Electroless copper plating baths are in widespread use in metallization industries for depositing copper on various types of substrates. In the manufacture of printed circuit boards, for example, the electroless copper baths are used...

Claims

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Application Information

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IPC IPC(8): C23C18/40
CPCC23C18/405C23C18/1675C23C18/40C23C18/30
Inventor LIFSCHITZ ARRIBIO, ALEJO M.GUMBLEY, PATRICIALIPSCHUTZ, MICHAELLIU, FENGMULZER, CATHERINEWEN, SARAH
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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